Intel, Facebook Collaborate on Future Data Center Rack Technologies

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New Photonic Architecture Promises to Dramatically Change Next Decade of
Disaggregated, Rack-Scale Server Designs

NEWS HIGHLIGHTS

* Intel and Facebook* are collaborating to define the next generation of rack
technologies that enables the disaggregation of compute, network and storage
resources.
* Quanta Computer* unveiled a mechanical prototype of the rack architecture to
show the total cost, design and reliability improvement potential of
disaggregation.
* The mechanical prototype includes Intel Silicon Photonics Technology,
distributed input/output using Intel Ethernet switch silicon, and supports the
Intel Xeon processor and the next-generation system-on-chip Intel Atom processor
code named "Avoton."
* Intel has moved its silicon photonics efforts beyond research and development,
and the company has produced engineering samples that run at speeds of up to 100
gigabits per second (Gbps).

SANTA CLARA, Calif.--(Business Wire)--
OPEN COMPUTE SUMMIT -- Intel Corporation announced a collaboration with
Facebook* to define the next generation of rack technologies used to power the
world`s largest data centers. As part of the collaboration, the companies also
unveiled a mechanical prototype built by Quanta Computer* that includes Intel`s
new, innovative photonic rack architecture to show the total cost, design and
reliability improvement potential of a disaggregated rack environment.

"Intel and Facebook are collaborating on a new disaggregated, rack-scale server
architecture that enables independent upgrading of compute, network and storage
subsystems that will define the future of mega-datacenter designs for the next
decade," said Justin Rattner, Intel`s chief technology officer during his
keynote address at Open Computer Summit in Santa Clara, Calif. "The
disaggregated rack architecture includes Intel`s new photonic architecture,
based on high-bandwidth, 100Gbps Intel Silicon Photonics Technology, that
enables fewer cables, increased bandwidth, farther reach and extreme power
efficiency compared to today`s copper based interconnects."

Rattner explained that the new architecture is based on more than a decade`s
worth of research to invent a family of silicon-based photonic devices,
including lasers, modulators and detectors using low-cost silicon to fully
integrate photonic devices of unprecedented speed and energy efficiency. Silicon
photonics is a new approach to using light (photons) to move huge amounts of
data at very high speeds with extremely low power over a thin optical fiber
rather than using electrical signals over a copper cable. Intel has spent the
past two years proving its silicon photonics technology was production-worthy,
and has now produced engineering samples.

Silicon photonics made with inexpensive silicon rather than expensive and exotic
optical materials provides a distinct cost advantage over older optical
technologies in addition to providing greater speed, reliability and scalability
benefits. Businesses with server farms or massive data centers could eliminate
performance bottlenecks and ensure long-term upgradability while saving
significant operational costs in space and energy.

Silicon Photonics and Disaggregation Efficiencies

Businesses with large data centers can significantly reduce capital expenditure
by disaggregating or separating compute and storage resources in a server rack.
Rack disaggregation refers to the separation of those resources that currently
exist in a rack, including compute, storage, networking and power distribution
into discrete modules. Traditionally, a server within a rack would each have its
own group of resources. When disaggregated, resource types can be grouped
together and distributed throughout the rack, improving upgradability,
flexibility and reliability while lowering costs.

"We`re excited about the flexibility that these technologies can bring to
hardware and how silicon photonics will enable us to interconnect these
resources with less concern about their physical placement," said Frank
Frankovsky, chairman of the Open Compute Foundation and vice president of
hardware design at supply chain at Facebook. "We`re confident that developing
these technologies in the open and contributing them back to the Open Compute
Project will yield an unprecedented pace of innovation, ultimately enabling the
entire industry to close the utilization gap that exists with today`s systems
designs."

By separating critical components from one another, each computer resource can
be upgraded on its own cadence without being coupled to the others. This
provides increased lifespan for each resource and enables IT managers to replace
just that resource instead of the entire system. This increased serviceability
and flexibility drives improved total-cost for infrastructure investments as
well as higher levels of resiliency. There are also thermal efficiency
opportunities by allowing more optimal component placement within a rack.

The mechanical prototype is a demonstration of Intel`s photonic rack
architecture for interconnecting the various resources, showing one of the ways
compute, network and storage resources can be disaggregated within a rack. Intel
will contribute a design for enabling a photonic receptacle to the Open Compute
Project (OCP) and will work with Facebook*, Corning*, and others over time to
standardize the design. The mechanical prototype includes distributed
input/output (I/O) using Intel Ethernet switch silicon, and will support the
Intel Xeon processor and the next generation, 22 nanometer system-on-chip (SoC)
Intel Atom processor, code named "Avoton," available this year.

The mechanical prototype shown today is the next evolution of rack
disaggregation with separate distributed switching functions.

Intel and Facebook: A History of Collaboration and Contributions

Intel and Facebook have long been technology collaboration partners on hardware
and software optimizations to drive more efficiency and scale for Facebook data
centers. Intel is also a founding board member of the OCP, along with Facebook.
Intel has several OCP engagements in flight including working with the industry
to design OCP boards for Intel Xeon and Intel Atom based processors, support for
cold storage with the Intel Atom processor, and common hardware management as
well as future rack definitions including enabling today`s photonics receptacle.

About Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company
designs and builds the essential technologies that serve as the foundation for
the world`s computing devices. Additional information about Intel is available
at newsroom.intel.com and blogs.intel.com.

Intel, the Intel logo Xeon, Intel Atom and Intel Core are trademarks of Intel
Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel
Mark O. Miller
916-380-2090
mark.o.miller@intel.com

Copyright Business Wire 2013