STATS ChipPAC and UMC Unveil World's First 3D IC Developed under an Open Ecosystem Model<2303.TW>

Tue Jan 29, 2013 5:00am EST

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Package-level reliability success is a significant milestone towards the
prove-out of a full-scale 3D IC solution for customers
HSINCHU,  Taiwan, Jan. 29, 2013 /PRNewswire/ -- STATS ChipPAC Ltd. (SGX-ST: 
STATSChP), a leading semiconductor advanced packaging and test service provider,
and  United Microelectronics Corporation  (NYSE: UMC; TWSE: 2303) ("UMC"), a
leading global semiconductor foundry, today announced the world's first
demonstration of TSV-enabled 3D IC chip stacking technology developed under an
open ecosystem collaboration. The 3D chip stack, consisting of a Wide I/O memory
test chip stacked upon a TSV-embedded 28nm processor test chip, successfully
reached a major milestone on package-level reliability assessment. This success
demonstrates a total solution for reliable 3D IC manufacturing through the
combination of UMC's foundry and STATS ChipPAC's packaging services.  

"The next level of chip integration is rapidly evolving, and 3D IC technology is
poised to enable the next frontier of IC capabilities for customers under
various deployment models," said Shim Il Kwon, VP of Technology Innovation of
STATS ChipPAC. "The open ecosystem collaborative approach drives proven and
reliable 3D IC solutions for the semiconductor market by combining the foundry
partner's robust, leading-edge TSV and front-end-of-line (FEOL) process
technologies in a complementary platform with an Outsourced Semiconductor
Assembly and Test (OSAT) service provider with innovative engineering excellence
to seamlessly integrate mid-end-of-line (MEOL) and back-end-of-line (BEOL) 3D IC
processes. We are pleased with UMC's commitment to this role and look forward to
future collaborations. The results are a proven solution platform that will
enable customers to capitalize on new market opportunities."

S.C. Chien, vice president of Advanced Technology Development at UMC, said, "We
see no imperative to restrict 3D IC to a captive business model, as UMC's
development work with nearly all the major OSAT partners for 3D IC has been very
productive. Our successful collaboration with a leading OSAT partner like STATS
ChipPAC has further established the viability of an open ecosystem approach.
This model should work especially well for our mutual 3D IC customers, as
foundry and OSAT can utilize their respective core strengths during development
and delivery, while customers can benefit from keeping supply chain management
flexible and realize better transparency over technology access compared to
closed, captive 3D IC business models."

UMC and STATS ChipPAC's proven open ecosystem 3D IC approach sets an important
standard for collaboration within the industry supply chain to achieve mutual
success. Under the 3D IC open development project with STATS ChipPAC, UMC
provides the FEOL wafer manufacturing, with a foundry grade fine pitch, high
density TSV process that can be seamlessly integrated with UMC's 28nm poly SiON
process flow. The know-how developed will be applied towards implementation on
the foundry's 28nm High-K/metal gate process. For MEOL and BEOL, STATS ChipPAC
performs the wafer thinning, wafer backside integration, fine pitch copper
pillar bump and precision chip-to-chip 3D stacking.

About STATS ChipPAC Ltd.  

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions in diverse end market
applications including communications, digital consumer and computing. With
global headquarters in  Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices throughout  Asia,  the
United States  and  Europe. STATS ChipPAC is listed on the SGX-ST. Further
information is available at  

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that
provides advanced technology and manufacturing for applications spanning every
major sector of the IC industry. UMC's customer-driven foundry solutions allow
chip designers to leverage the company's leading-edge processes, which include
28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS,
and a wide range of specialty technologies. Production is supported through 10
wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in 
Taiwan  and  Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are
in production for customer products down to 28nm. Construction is underway for
Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000
people worldwide and has offices in  Taiwan,  Japan,  Singapore,  Europe, and 
the United States. UMC can be found on the web at

Note From UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking within
the meaning of the U.S. Federal Securities laws, including statements about
future outsourcing, wafer capacity, technologies, business relationships and
market conditions. Investors are cautioned that actual events and results could
differ materially from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and economy; acceptance
and demand for products from UMC; and technological and development risks.
Further information concerning these risks is included in UMC's filings with the
U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.

Editorial Contacts:

 UMC                           STATS ChipPAC                 
Richard Yu                   
Lisa Lavin                   
+886-2-2658-9168 ext. 16951  

SOURCE  United Microelectronics Corporation

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