Toshiba Ships Samples of Industry's First Universal Flash Storage Devices

Thu Feb 7, 2013 9:04pm EST

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JEDEC UFS Ver.1.1 Standard Compliant Embedded Memories Combine up to 64GB NAND
and a Controller in a Single Package
TOKYO  and  IRVINE, Calif.,  Feb. 7, 2013  /PRNewswire/ -- Toshiba Corporation
and  Toshiba America Electronic Components, Inc.,  (TAEC)*, a committed leader
that collaborates with technology companies to create breakthrough designs,
today announced that it began shipping samples of its 64-gigabyte (GB) embedded
NAND flash memory module equipped with a Universal Flash Storage (UFS)
interface. The first in the industry[1], the new module is fully compliant with
the JEDEC UFS[2]  Ver.1.1 standard  [3], and is designed for a wide range of
digital consumer products - including smartphones and tablet PCs.  

With improved data processing speeds in host chipsets and wider bandwidths for
wireless connectivity, demand continues to grow for large density,
high-performance memory that supports high resolution video. A proven innovator
in this key area, Toshiba is reinforcing its leadership role by being the first
in the industry to ship samples with a 64GB UFS module.   

Samples are mainly intended for evaluation of the UFS interface and its protocol
in host chipsets and by OS vendors. Toshiba will schedule mass production of the
64GB UFS module, as well as other densities in its lineup, according to market


 Part Number      Density  Package       Sample shipment  
 THGLF0G9B8JBAIE  64GB     169Ball FBGA  January 2013     

Key Features

* The JEDEC  UFS  Ver.1.1 compliant interface handles essential functions,
including writing block management, error correction and driver software. It
simplifies system development, allowing manufacturers to minimize development
costs and speed up time to market for new and upgraded products.  
* UFS has a serial interface and

scalability in terms of number of lanes and speed[4].  
* The new products are sealed in a small FBGA package, 12x16x1.2mm and have a
signal layout compliant with JEDECUFS  Ver.1.1.

[1]For embedded NAND flash memory modules. Source: Toshiba, as of  February
[2]Universal Flash Storage is a product category for a class of embedded memory
products built to the JEDEC UFS standard specification.
[3]JEDEC UFS Ver.1.1 standard has already been published. The Ver.2.0 standard
is now under discussion by JEDEC.
[4]JEDEC UFS Ver.2.0 standard will support multiple-lane and interface speed.


 Interface             JEDEC UFS Version 1.1 standard           
 Power Supply Voltage  2.7V to 3.6V           (Memory core)     
1.70V to 1.95V     (Controller core)    
1.10V to 1.30V       (UFS I/F signals)  
 Number of lanes       Downstream 1 lane / Upstream 1 lane      
 Interface Speed       2.9Gbps/lane                             
 Temperature range     -25degrees to +85degrees Celsius         
 Package               169Ball 12x16x1.2mm FBGA                 

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable
electronic components, Toshiba enables its customers to create market-leading
designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs,
CMs, VARs, distributors and fabless chip companies worldwide.  A committed
electronic components leader, Toshiba designs and manufactures high-quality
flash memory-based storage solutions, solid state drives (SSDs), hard disk
drives (HDDs), discrete devices, advanced materials, medical tubes, custom
SoCs/ASICs, imaging products, microcontrollers and wireless components that make
possible today's leading smartphones, tablets, MP3 players, cameras, medical
devices, automotive electronics, enterprise solutions and more. 

Toshiba America Electronic Components, Inc.  is an independent operating company
owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation,  Japan's
largest semiconductor manufacturer and the world's third largest semiconductor
manufacturer (Gartner, 2011 Worldwide Semiconductor Revenue, March, 2012). 
Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and
affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at 

For additional company and product information, please visit

Product density is identified based on the density of memory chip(s) within the
Product, not the amount of memory capacity available for data storage by the end
user. Consumer-usable capacity will be less due to overhead data areas,
formatting, bad blocks, and other constraints, and may also vary based on the
host device and application. Maximum read and write speed may vary depending on
the host device, read and write conditions, and file size.  For purposes of
measuring read and write speed in this context, 1 megabyte or MB = 1,000,000

Information in this press release, including product pricing and specifications,
content of services and contact information, is current and believed to be
accurate on the date of the announcement, but is subject to change without prior
notice.  Technical and application information contained here is subject to the
most recent applicable Toshiba product specifications.  In developing designs,
please ensure that Toshiba products are used within specified operating ranges
as set forth in the most recent Toshiba product specifications and the
information set forth in Toshiba's "Handling Guide for Semiconductor Devices,"
or "Toshiba Semiconductor Reliability Handbook."  This information is available
at, or from your TAEC representative.

All trademarks and tradenames held within are the properties of their respective

Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080

SOURCE  Toshiba America Electronic Components, Inc.

Rebecca Bueno, Toshiba America Electronic Components, Inc., +1-949-623-3099,

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