Air Products to Highlight Advances in Electron Attachment for Soldering Applications at IPC APEX Expo

Mon Feb 11, 2013 3:48pm EST

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EA Activated Hydrogen Technology Enables Fluxless Die Attach with Zero to
Near-Zero Voids
LEHIGH VALLEY, Pa.,  Feb. 11, 2013  /PRNewswire/ -- Air Products (NYSE: APD)
will highlight advances in its proprietary electron attachment (EA) technology
for soldering applications at the IPC APEX Expo in  San Diego, Calif., from 
February 19-21. IPC APEX attendees can stop by Air Products Booth #2708 to learn
about the advantages of EA activated hydrogen over plasma-based and flux-based
processes for cleaning soldering surfaces during electronics assembly and
packaging. These advantages include improved solder wetting, lower reflow
temperature, decreased overall voiding tendency, and no flux residue-related
problems.

In addition, Dr.  Christine Dong, lead research scientist for merchant gases
technology at Air Products, will present the results of a study on EA technology
titled "Fluxless Die Attach by Activated Forming Gas." The study demonstrates
that it is possible to achieve a high-quality die attach with zero or near-zero
voids by using EA. Dr. Dong's presentation is part of the  Novel Attachment
Technologies and Processes  (S34) conference paper session to be held on 
Thursday, February 21, from  10:15 AM to 12:00 PM. IPC APEX attendees can 
register  to learn how EA-activated forming gas can effectively clean soldering
surfaces during fluxless die attach, bringing numerous advantages compared with
conventional flux-based processes.  

Air Products representatives will be available at the booth to speak with IPC
APEX attendees about the company's complete range of  application technologies
and solutions  that can help electronics packaging and assembly customers
improve productivity and optimize their total cost of ownership. Among these
solutions are the use of nitrogen reflow for Head-in-Pillow defect reduction and
 Air Products Inert Wave Soldering  technology, which has helped an electronics
contract assembly company reduce wave solder defects by 90%, enabling them to
achieve improved production efficiencies and cost savings.  

Air Products is a leading supplier of specialty gases and chemicals, bulk gases,
and delivery equipment and services to the global electronics industry. For more
than 25 years, the company has been providing the  electronics packaging,
assembly and test  industry with technology, gases, and know-how for wave,
reflow, and selective soldering. In addition to printed circuit assembly
processes, Air Products' global technology team can support several areas of
integrated circuit packaging assembly. With a complete portfolio of reliable gas
supply options-from liquid/bulk gases to a host of on-site production
technologies-Air Products can meet the purity requirement, volume, or usage
pattern of any customer, anywhere around the world. For more information, visit 
www.airproducts.com/electronics_assembly.

About Air Products

Air Products (NYSE: APD) provides atmospheric, process and specialty gases;
performance materials; equipment; and technology. For over 70 years, the company
has enabled customers to become more productive, energy efficient and
sustainable. More than 20,000 employees in over 50 countries supply innovative
solutions to the energy, environment and emerging markets. These include
semiconductor materials, refinery hydrogen, coal gasification, natural gas
liquefaction, and advanced coatings and adhesives. In fiscal 2012, Air Products
had sales approaching  $10 billion. For more information, visit 
www.airproducts.com.  

NOTE: This release may contain forward-looking statements within the safe harbor
provisions of the Private Securities Litigation Reform Act of 1995. These
forward-looking statements are based on management's reasonable expectations and
assumptions as of the date of this release regarding important risk factors.
Actual performance and financial results may differ materially from projections
and estimates expressed in the forward-looking statements because of many
factors not anticipated by management, including risk factors described in the
Company's Form 10K for its fiscal year ended  September 30, 2012.  

EDITOR'S NOTE:
Air Products will unveil additional information about the company's electron
attachment technology at  www.airproducts.com/noflux  on  February 19th  in
conjunction with the IPC APEX Expo.  

SOURCE  Air Products


Media Inquiries: Debbie Bauer, +1-610-481-8061, bauerda@airproducts.com;
Investor Inquiries:  Simon Moore, +1-610-481-7461, mooresr@airproducts.com

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