Spain to issue new bond due 2016 on April 4

MADRID, March 27 Wed Mar 27, 2013 9:07am EDT

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MADRID, March 27 (Reuters) - Spain Treasury on Wednesday said it planned to issue a new bond due July 30, 2016 with a 3.3 percent coupon on April 4.

The Treasury said it will also issue bonds due July 30, 2018, with a 4.1 percent coupon and April 30, 2021 with a 5.5 percent coupon on the same day.

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