Taiwan's Advanced Semiconductor launches $400 mln convertible bond-terms

HONG KONG Thu Aug 29, 2013 3:03am EDT

HONG KONG Aug 29 (Reuters) - Taiwan's Advanced Semiconductor Engineering Inc plans to raise $400 million selling convertible bonds due 2018, according to a term sheet of the deal seen by Reuters on Thursday.

The zero-coupon bonds were launched with an initial conversion price of T$32.45 to T$34.36, according to the term sheet.

Citigroup Inc was hired as sole global coordinator for the offering, with CIMB, Credit Suisse and DBS acting as joint bookrunners, the term sheet showed.

Comments (0)
This discussion is now closed. We welcome comments on our articles for a limited period after their publication.