BRIEF-China Wafer Level resumes IPO plans in Shanghai, sets IPO price at 19.16 yuan/share

Tue Jan 21, 2014 4:17am EST

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Jan 21 (Reuters) - China Wafer Level CSP Co Ltd

* Says resumes IPO plans in Shanghai, sets IPO price at 19.16 yuan ($3.17) per share

Source text in Chinese: link.reuters.com/wyt26v

link.reuters.com/xyt26v

Further company coverage: (Reporting by Hong Kong and Singapore newsrooms)

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