FlipChip International and IC Interconnect Announce U.S. Sales and Marketing
Agreement for Wafer Level Packaging Services.
PHOENIX and COLORADO SPRINGS Colo., Oct. 26 /PRNewswire/ -- FlipChip
International, (FCI), the global technology leader in flip-chip bumping and
Wafer Level Packaging and IC Interconnect (ICI), a TS16949 registered leader
in electroless Nickel flip-chip bumping and Wafer Level Packaging announced
today a U.S. joint Sales and Marketing agreement. This agreement allows their
respective U.S. customers access to the extensive service portfolios of both
FCI and ICI.
FCI will continue to provide turn-key Wafer Level Packaging services in the
U.S. and electroless Nickel bumping in China at its FCMS Joint Venture. ICI
will continue its U.S. and Asian operations based on electroless Nickel
bumping and stencil printed solder paste services.
Both companies will work with existing and new customers to offer the optimum
technology for the particular demands of each application in the coming
generations of packaging to be utilized in mobile handsets, medical devices,
automotive integrated circuits, microprocessors, graphics processors, and
wireless 3G integrated solutions. This agreement will not impact any of the
other alliances either company has formed.
"This outstanding strategic alliance confirms the strong relationship between
two internationally recognized semiconductor providers and validates the
global strategic importance of Wafer Level Packaging and flip-chip bumping for
next generation products, including 3G mobile handsets," said Bob Forcier, FCI
President and CEO.
Curt Erickson, President of ICI, said, "We are excited to form this alliance
with FCI, which leverages the strengths of two robust technology portfolios
and provides the most comprehensive U.S. bumping solutions available in the
market today. In addition to bumping technologies, the alliance offers
customers the potential of a one-stop solution for backend services in the USA
and multiple migration pathways to Asia.
ICI is a privately held supplier of products and services for the wafer
bumping and wafer scale packaging semiconductor market. ICI is a wholly owned
by Eagle Investment I-II, LLC a capital source dedicated to start-ups with 1
to 5 million dollar capitalization needs.
FCI is a privately held supplier of products and services for the wafer
bumping and wafer level packaging market. FCI is a wholly owned subsidiary of
RoseStreet Labs LLC, a supplier of products and services for the
semiconductor, renewable energy and life sciences, markets.
Contact information:
Dawn Cuevas Curt Erickson
FlipChip International, LLC IC Interconnect, LLC
602-431-6637 719-533-1030 ext. 102
dawn.cuevas@flipchip.com cerickson@icinterconnect.com
website: www.flipchip.com www.icinterconnect.com
SOURCE FlipChip International
Dawn Cuevas of FlipChip International, LLC, +1-602-431-6637,
dawn.cuevas@flipchip.com; or Curt Erickson of IC Interconnect, LLC,
+1-719-533-1030, ext. 102, cerickson@icinterconnect.com
