Elite 300 yields new measurement capability vital for probing at 45nm and
below
BEAVERTON, Ore., Jan. 7 /PRNewswire-FirstCall/ -- Cascade Microtech today
introduced the next step in 300mm wafer probe stations designed to meet the
worldwide need for advanced on-wafer measurements for semiconductor devices.
Based on Cascade Microtech's industry-leading wafer probing products, the
Elite 300 sets a new standard for extremely accurate and reliable 300mm wafer
probing for devices with process nodes at 45nm and below. The Elite 300 solves
the critical measurement challenges at each advancing technology node by
incorporating state-of-the-art electrical and mechanical technology, advanced
materials and leading-edge measurement techniques.
"As the market leader, our customers expect us to enable significant
productivity gains as they migrate to 45nm process nodes and beyond. The Elite
300 platform is designed to lower process development costs and shorten time
to market through superior electrical measurement capability," said Geoff
Wild, chief executive officer, Cascade Microtech.
The Elite 300 offers end-to-end productivity improvements through its
advanced ergonomic design, market-leading measurement capability and
flexibility to be the wafer probing platform of choice now and in the future.
Elite 300 applications include RF/DC device characterization and modeling,
wafer-level reliability, IC failure analysis and design debug. By acquiring
the advanced Elite 300 wafer probe station today, semiconductor manufacturers
won't have to retool at each process node or lose business to competing
foundries with more accurate test capabilities. The potential savings could
amount to hundreds of thousands of dollars over the next three to five years
and the next two to three process nodes, based on typical capital purchasing
cycles in the semiconductor industry.
Problems arise when testing geometries at 45nm and below
Geometries at 45nm and below bring about new problems for wafer-level
measurements. New process materials, lower operating voltages and increasingly
complex IC designs require billions of dollars of investment in front-end
processes and equipment. A reciprocal investment is required at the back-end
for much more advanced probing stations to handle low noise environments,
small pad probing, wide-range temperature testing, internal node probing and
multi-site testing. The Elite 300 offers all of these advanced measurement
capabilities with high throughput and high reliability to ensure confidence in
data collected.
-- Low noise environment
At 45nm and below, the need to ensure lower operating and bias
voltages, plus the use of new materials, has compounded the challenges
of making accurate, low-level, on-wafer device measurements. When noise
immunity requirements cannot be met for lower stimulus and measurement
test levels, both external environmental noise and internal thermal
chuck noise prevent critical measurements such as 1/f. Leveraging major
technology improvements, the Elite 300 is the world's lowest-noise
environment for ultra low-level noise measurements. With next
generation PureLine II performance, Cascade Microtech's proprietary
noise-reduction technology, the Elite 300 enables up to 10 times lower
spectral noise and four times better AC noise.
-- Small pad probing
As test pad sizes scale down to 30 microns squared and below, obstacles
such as thermal expansion, wafer flatness, planarity and stepping
accuracy have made it difficult to accurately land probe needles on
small pads with good contact during step-and-repeat wafer measurements.
The Elite 300's architectural upgrades offer improved stepping
accuracy, ensure flatness and planarity, and prevent probe needle
shifting. The software automatically tracks wafer movement; an upward-
looking camera system is included for advanced vertical probe cards.
-- Thermal measurements
Today, the demand for higher IC performance, quality and yield requires
more thermal test data. As this trend grows, manufacturers must have
probe stations that offer a much wider temperature range and higher
throughput. The Elite 300 meets both of these needs. It offers the
industry's widest standard temperature range (-60 C to 300 C) plus a
400 C thermal chuck option. For faster throughput, the Elite 300 has 25
percent faster transition times, ultra-steady probe and probe card
mechanical stability that is critical for over-temperature
measurements, an automated air management system, and wafer lift pins
to enable high-temperature wafer loading/unloading to eliminate thermal
cycling.
-- Internal node probing
Higher IC complexity (for example, DRAM and logic) and tighter circuit
timing tolerances require more tests on more nodes to accurately verify
a new design. For precise internal-node, sub-micron probing over
temperature, the Elite 300 has thermally matched components for
superior mechanical stability. With the new low-profile probe card
holder, simultaneous probe card and high impedance node probing is
easy. A new hands-free microscope bridge mount system, smart cabling,
accessory shelves, and ergonomic armrests all ensure faster setup and
easier navigation to, and within, test die.
-- Multi-site testing
A growing trend in wafer level reliability is the transition from
in-package testing to on-wafer measurements. In-package reliability
testing is not only costly, it adds weeks to development time. The
Elite 300 enables effortless multi-site, wafer-level reliability
testing with trustworthy, high-volume data collection. To accommodate
the need for on-wafer reliability measurements, the Elite 300 enables
easy setup, plus accurate, repeatable results for large- and small-area
multi-site test configurations. Wafer flatness, system and probe card
stability, plus compensation for thermal expansion are all addressed. A
300mm large-area microscope system, with video and software navigation,
eases verification of large area and full-wafer needle contact. In
addition, 400 C capability delivers more data, faster, for accelerated
breakdown.
Configurations, pricing and availability
To meet a variety of market needs, the Elite 300 is available in three
station models. The powerful Elite 300/AP features PureLine II, AttoGuard and
MicroChamber technologies, with a premium package of automation tools. The
Elite 300/M includes the MicroChamber, while the Elite 300/S features an open
platen with safety enclosure.
The Elite 300 wafer probe stations are available for order immediately.
Standard delivery is 12 weeks upon receipt of order. Pricing ranges from U.S.
$80,000 to $400,000, depending on the model and configuration.
About Cascade Microtech
Cascade Microtech, Inc. (Nasdaq: CSCD) is a worldwide leader in the
precise electrical measurement and test of integrated circuits (ICs) and other
small structures. For technology businesses and scientific institutions that
need to evaluate small structures, Cascade Microtech delivers access to, and
extraction of, electrical data from wafers, integrated circuits (ICs), IC
packages, circuit boards and modules, MEMS, biological structures,
electro-optic devices and more.
Cascade Microtech's leading-edge semiconductor production test consumables
include unique probe cards and test sockets that reduce manufacturing costs of
high-speed and high-density semiconductor chips. Information about Cascade
Microtech can be found on the Web at http://www.cascademicrotech.com.
SOURCE Cascade Microtech, Inc.
Debra Seifert of McClenahan Bruer Communications, +1-503-546-1000,
debra@mcbru.com, for Cascade Microtech, Inc.; or Cali Sartor of Cascade
Microtech, Inc., +1-503-601-1000, cali_sartor@cmicro.com
