Dongbu HiTek and SETi Co-Develop 1.3 Megapixel CMOS Image Sensor (CIS) Chip at 110-nanometer Node
New CIS Chip Targets Major Mobile Handset Manufacturers; Volume
Production to Begin as Early as Q1-2008
SEOUL, South Korea--(Business Wire)--Dongbu HiTek today announced that it has completed development of
a 1.3 megapixel CMOS image sensor (CIS) device at the 110nm node.
Targeting major manufacturers of mobile handsets worldwide, the new
CIS chip was developed in partnership with the company's SETi
subsidiary, which specializes in CIS design. Volume production is
scheduled to begin as early as the first quarter of 2008.
The new 110nm CIS chip announced today represents Dongbu HiTek's
first joint product development with SETi, which became a
majority-owned subsidiary in July 2007. Dongbu HiTek expects
continuing collaboration with SETi to drive the sequential near-term
development of proprietary 2, 3, and 5 megapixel CIS chips at the
110nm node. Moreover, SETi is expected to play a key role in expanding
Dongbu HiTek's semiconductor business beyond foundry processing into
the manufacturing and sales of proprietary chips and modules.
According to Dongbu HiTek, several of its chip design and
processing specialists worked closely with the SETi design team to
complete the 110nm CIS development. The company confirmed that its
internally developed design library was used as the database. Thanks
to the combination of Dongbu HiTek's best-in-class chip design
library, high-quality process development capabilities, and SETi
collaboration, the proprietary 110nm CIS chip was developed in just
six months, about half the time it would typically take.
According to In-Stat's recently published market research report,
"Image Sensors 2007: CMOS is Everywhere" (#IN0703690MI), the global
image sensor market saw strong growth in 2006 due primarily to the
demand for camera phones, which accounted for more than three-quarters
of all image sensors shipped. The report stated that CIS devices
dominated CCD devices in units shipped during 2006 as it captured
nearly an 80 percent share of all image sensor shipments while also
making inroads into digital still cameras and camcorders, two markets
traditionally dominated by CCDs. The report also confirmed that the
rapidly growing digital single lens reflex (DSLR) market has been
transitioning to CIS devices.
Dongbu HiTek disclosed that it has special process technologies
now under development that promise to considerably reduce CIS chip
size while maintaining high image quality. The company anticipates
making any necessary investments that will enhance the global sales
and profitability of advanced CIS chips developed in partnership with
its SETi subsidiary.
In addition to specializing in proprietary CIS design and process
technologies for mobile handset applications, Dongbu HiTek also
specializes in Display Driver IC (DDI) technologies for a broad range
of display applications. Having already internally developed a 130nm
DDI design library, Dongbu HiTek is now using its own IP to complete
development of a proprietary 110nm DDI design library early next year.
About Dongbu HiTek
Headquartered in Seoul, Korea, Dongbu HiTek Co., Ltd. offers
advanced products and services across three major business areas:
Agriculture, Materials and Semiconductor. The Semiconductor Business
provides specialized proprietary chips and modules as well as foundry
services that add high value to display, mobile and various analog
applications. The company's two world-class fabs currently process
200mm wafers at nodes ranging from 0.35 microns to 110 nanometers.
This wafer processing is supported by comprehensive design support (IP
and design libraries), prototype development/verification, and
packaging/module development. The Semiconductor Business specializes
in developing best-in-class CMOS Image Sensor (CIS) and Display Driver
IC (DDI) chips as well as chips that incorporate either High Voltage
or Flash memory functions. Dongbu HiTek's stock is publicly traded
under 000990 on the Korea Stock Exchange. For more information, visit
www.dongbuhitek.com.
Dongbu HiTek HQ
Kevin Lee, +82.17.337.4698
kevin.lee@dongbu.com
or
Dongbu HiTek USA/ Europe
Elizabeth Estrella-Basilio, +1 408-238-8822
elizabeth@crossborderpr.com
Copyright Business Wire 2008
