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Qualcomm Expands Snapdragon Platform with 45nm Chipset for Smarter Smartphones and...

Sun May 31, 2009 9:00pm EDT
Qualcomm Expands Snapdragon Platform with 45nm Chipset for Smarter Smartphones
and Smartbooks

- New QSD8650A Chipset Offers Faster Processing, Longer Battery Life and
Enhanced 2D/3D Graphics -

TAIPEI, Taiwan, May 31 /PRNewswire-FirstCall/ -- Qualcomm Incorporated
(Nasdaq: QCOM), a leading developer and innovator of advanced wireless
technologies, products and services, today announced it is expanding the
Snapdragon(TM) platform with a next-generation chipset that uses 45 nanometer
(nm) process technology to provide faster processing, significant battery life
improvements and other enhancements for the user experience on
Snapdragon-powered smartphones and smartbooks.  The new Snapdragon
QSD8650A(TM) chipset - scheduled for sampling before the end of 2009 - offers
significant performance improvements including a 1.3 GHz processor for 30
percent higher performance as well as enhanced multimedia and 2D/3D graphics. 
Utilizing 45nm technology also allows power consumption improvements such as
up to 30 percent lower dynamic power than previous-generation Snapdragon
products and an unmatched standby power of less than 10 millwatts.

"This latest addition to the growing family of Snapdragon chipsets will help
our customers to develop faster, more power-efficient smartphones and
smartbooks," said Luis Pineda, senior vice president of marketing and product
management at Qualcomm CDMA Technologies.  "This new 45 nm device shows our
continued commitment to extending the capabilities of the Snapdragon platform
with leading-edge process technology and an expanded list of integrated
features."

The QSD8650A chipset offers an exceptionally high level of integration.  In
addition to its faster processor and faster bus speed, the new QSD8650A
chipset also offers multi-mode UMTS and CDMA 3G mobile broadband connectivity
in the same 15x15mm package as current Snapdragon chipsets.  A standalone,
power-efficient 2D graphics accelerator and enhanced 3D graphics core deliver
a powerful multimedia experience with better performance of Adobe(R) Flash(R)
software.  It also features integrated GPS and high-definition video recording
and playback, the latest Bluetooth(R) 2.1 technology and support for Wi-Fi,
high-resolution WXGA displays and mobile TV technologies such as MediaFLO(TM),
DVB-H and ISDB-T.

In addition to the new QSD8650A chipset, Qualcomm's Snapdragon family includes
the original 1 GHz QSD8x50(TM) chipsets and the 45 nm QSD8672(TM) chipset with
dual CPUs capable of up to 1.5 GHz for even faster response and processing. 
More than 15 manufacturers are now developing more than 30 Snapdragon-based
products, the first of which is the Toshiba TG01 Smartphone, introduced in
February 2009.

Qualcomm Incorporated (Nasdaq: QCOM) is a leader in developing and delivering
innovative digital wireless communications products and services based on CDMA
and other advanced technologies.  Headquartered in San Diego, Calif., Qualcomm
is included in the S&P 100 Index, the S&P 500 Index and is a 2009 FORTUNE
500(R) company.  For more information, please visit www.qualcomm.com.

Qualcomm is a registered trademark of Qualcomm Incorporated.  MediaFLO,
Snapdragon, QSD8x50, QSD8650A and QSD8672 are trademarks of Qualcomm
Incorporated.  All other trademarks are the property of their respective
owners.

Nothing in these materials is an offer to sell any of the parts referenced
herein. Certain components are available for use in the United States only
through licensed suppliers.

    Qualcomm Contacts:
    Kira Lee Golin, Qualcomm CDMA Technologies
    Phone:  1-858-651-1554
    Email:  qctpublicrelations@qualcomm.com

    Tina Asmar, Corporate Communications
    Phone:  1-858-845-5959
    Email:  corpcomm@qualcomm.com

    John Gilbert, Investor Relations
    Phone:  1-858-658-4813
    Email:  ir@qualcomm.com




SOURCE  Qualcomm Incorporated

Kira Lee Golin, Qualcomm CDMA Technologies, +1-858-651-1554,
qctpublicrelations@qualcomm.com, or Tina Asmar, Corporate Communications,
+1-858-845-5959, corpcomm@qualcomm.com, or John Gilbert, Investor Relations,
+1-858-658-4813, ir@qualcomm.com



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