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Toshiba Adds Low On-Resistance, Fast Switching 30V MOSFETs for DC-DC Conversion in Compact, High-Current, TSON Advance Package

Wed Nov 11, 2009 1:10pm EST
Toshiba Adds Low On-Resistance, Fast Switching 30V MOSFETs for DC-DC
Conversion in Compact, High-Current, TSON Advance Package
Six new 30V MOSFETs for Synchronous DC-DC Increase Power Efficiency




 

IRVINE, Calif., Nov. 11 /PRNewswire/ -- Toshiba America Electronic Components,
Inc. (TAEC)*, a committed leader that collaborates with technology companies
to create breakthrough designs, has expanded its offering of 30V MOSFETs with
six devices in TSON Advance packages. The new devices are intended for
synchronous DC-DC converter applications in mobile and desktop computers,
servers, game consoles and other electronic devices that require input voltage
conversion for subsystems such as the processor, memory and other
point-of-load devices.  Developed by Toshiba Corp., (Toshiba) the devices are
based on fifth and sixth generation UMOS V-H and UMOS VI-H process
technologies to achieve low on-state resistance for the low side MOSFET and
fast switching speed for high side MOSFET enabled through lower gate charge
(Q(SW)).  The thin, compact, 3.3mm x 3.3mm x 0.9mm TSON Advance package
reduces mount area requirements by 64 percent compared to the widely used
5.0mm x 6.0mm SOP-8 package, while achieving the same power dissipation of
1.9W.

The new lineup includes five N-channel MOSFETs and one MOSBD, a combination
MOSFET and Schottky Barrier Diode in a single die that provides a low
inductance structure and thus, improves power efficiency.  The lineup provides
a range of characteristics to enable designers to meet various system
requirements.  Current ratings range from 13A to 26A, R(DS)(ON) (typ.) from
4.3 to 12.2milliohms, input capacitance(Ciss) from 990 to 2200 picofarads (pF)
(typ.), and reverse transfer capacitance (Crss) from 54 to 140pF (typ.).
Please see table below for details.

"With TSON Advance packaging, our latest MOSFETs offer designers new options
to increase board density and save space, with a selection of high efficiency
solutions for DC-DC conversion," said Jeff Lo, business development manager,
Discrete Power Devices, for TAEC.

    Technical Specifications
    ------------------------

                        Maximum
                        Rating   R(DS)(ON)(milliohms)C(rss) C(iss) r(g)
    Product           ---------- --------- ---------  (pF)  (pF) (ohms)
    Number  Polarity V(DSS) I(D)   Typ.      Max.     Typ.  Typ.  Typ. Process
                      (V)  (A)
    ------  --------  ---  ---     ---       ---      ---   ---   ---  -------

    TPCC8001-H  N-    30   22      5.5       8.3      110  1900   1.0   UMOS
              Channel           V(GS)=10V  V(GS)=10V                     V-H
    --------- ------- --   --   ---------   --------   ---  ----   ---   ----

    TPCC8002-H  N-    30   22      5.5        8.3     110  1900   3.2   UMOS
              Channel           V(GS)=10V  V(GS)=10V                     V-H
    --------- ------- --   --   ---------  ---------  ---  ----   ---   ----

    TPCC8003-H  N-    30   13     12.2      16.9       63   990   0.8   UMOS
              Channel           V(GS)=10V  V(GS)=10V                    VI-H
    --------- ------- --   --   ---------  ---------   --  ----   ---   ----

    TPCC8005-H  N-    30   26      4.3        6.4     140  2200   3.4   UMOS
              Channel           V(GS)=10V  V(GS)=10V                    VI-H
    --------- ------- --   --   ---------  ---------  ---  ----   ---   ----

    TPCC8006-H  N-    30   22      5.3        8.0     110  1700   2.8   UMOS
              Channel           V(GS)=10V  V(GS)=10V                    VI-H
    --------- ------- --   --   ---------  ---------  ---  ----   ---   ----

    TPCC8A01-H  N-    30   21      7.1        9.9      54  1430   1.5   UMOS
              Channel           V(GS)=10V  V(GS)=10V                    V-H
               MOSBD                                                   MOSBD
    --------- ------- --   --   ---------  ---------   --  ----   ---  -----


Pricing and Availability
Samples of these latest additions to the Toshiba MOSFETs lineup in TSON
packages are available now, with mass production beginning to ramp.  Prices in
sample quantities start at $0.35.

Toshiba's Discrete Products

Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a
worldwide basis, based on annual revenue from international shipments of total
discrete products. According to the most recent annual report from market
research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top
discrete semiconductor supplier. (Source: "2008 Worldwide Semiconductor Market
Share Report," Gartner, April 2009). More specifically, Toshiba is a leading
supplier in a number of discrete product categories, including power
transistors, rectifiers, LMOS logic, CMOS logic, photocouplers, TOSLINKs,
LEDs, small signal diodes and transistors. The company's discrete devices are
designed to meet the growing demand for high-performance and lower voltages in
today's wireless telecommunications and consumer electronics applications,
while emphasizing its strength in the automotive and industrial markets.

*About TAEC and Toshiba Corp.
Through proven commitment, lasting relationships and advanced, reliable
electronic components, Toshiba enables its customers to create market-leading
designs.  Toshiba is the heartbeat within product breakthroughs from OEMs,
ODMs, CMs, distributions and fabless chip companies worldwide.  A committed
electronic components leader, Toshiba designs and manufactures high-quality
flash memory-based storage solutions, discrete devices, displays, advanced
materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging
products, microcontrollers and wireless components that make possible today's
leading cell phones, MP3 players, cameras, medical devices, automotive
electronics and more. 

Toshiba America Electronic Components, Inc. is an independent operating
company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation,
Japan's largest semiconductor manufacturer and the world's third largest
semiconductor manufacturer (Gartner, 2008 WW Semiconductor Revenue, April
2009).  For additional company and product information, please visit
http://www.toshiba.com/taec/.

Information in this press release, including product pricing and
specifications, content of services and contact information, is current and
believed to be accurate on the date of the announcement, but is subject to
change without prior notice.  Technical and application information contained
here is subject to the most recent applicable Toshiba product specifications. 
In developing designs, please ensure that Toshiba products are used within
specified operating ranges as set forth in the most recent Toshiba product
specifications and the information set forth in Toshiba's "Handling Guide for
Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This
information is available at http://www.chips.toshiba.com, or from your TAEC
representative. 




SOURCE  Toshiba America Electronic Components, Inc.

Jan Johnson of MultiPath Communications, +1-714-633-4008,
jan@multipathcom.com, for Toshiba America Electronic Components, Inc.; or
Rebecca Bueno of Toshiba America Electronic Components, Inc., +1-949-623-3098,
rebecca.bueno@taec.toshiba.com



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