Unique Technology Helps Create Smaller, More Sustainable, Less Expensive
Consumer Electronics
TAYUAN, Taiwan--(Business Wire)--
Dow Electronic Materials introduced its new line of metallization and imaging
products for printed circuit boards (PCB) at the recent TPCA show and IMPACT
Conference. These advanced materials provide high-performance, cost effective
solutions with improved environmental profiles for the PCB industry, and address
the demand for smaller, more sustainable, less expensive and better performing
consumer electronics.
* PCB Electrolytic Plating - MICROFILL EVF Via Fill provides greatly enhanced
via filling at exceptionally low surface thicknesses and is capable of
simultaneous through-hole plating. It is suitable for both HDI and IC
(Integrated Circuit) Substrate applications. The company received an Outstanding
Paper Award at recent IMPACT Conference for its excellent achievement in this
area. COPPER GLEAM HV-101 and HVS-202 Acid Copper provide high plating
efficiency which increases productivity and lowers plating cost for vertical
continuous plating applications. COPPER GLEAM MV-100 Acid Copper exhibits
exceptionally good metal distribution and better performance for vertical
in-line equipment with dramatic improvement in cycle time.
* PCB Making Holes Conductive -CIRCUPOSIT 3350-1 Electroless Copperoffers
excellent plating coverage and reliability, stable operation, and reduced
chemical consumption and waste generation for MLB (Multi-Layer Board) and HDI
applications. CIRCUPOSIT 7800 Desmearfor SAP (Semi-additive Process) delivers
uniform and stable adhesion promotion treatment and reliable via bottom
cleaning. It provides excellent plating coverage, high peeling strength and
reliability. A new Advanced Sweller product provides cost-effective, wide
operational window desmearing solutions for both normal and high performance
laminates with reduced toxicity solvent and low concentration chemistry.
CIRCUPOSIT 3323A Conditioner is a biodegradable conditioner for PTH (Plating
Through Hole) processes. Its excellent coverage and lower surface tension
provide exceptional performance and reliability.
* PCB Final Finish -PALLAMERSE SMT 2000 Electroless Palladium is designed for
use in ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
processes for both SMT (Surface Mount Technology) soldering and gold wire
bonding assembly applications. A new Low Gold Immersion Gold offers a highly
economical immersion gold option for ENIG (Electroless Nickel Immersion Gold)
processes. It sustains uniform gold thickness distribution and reliable
solderability with reduced gold consumption.
* PCB Imaging -EAGLE 2100 Photoresist is the latest 3-D negative
electrodeposited photoresist which is designed for a variety of substrate sizes
and geometries. It provides uniform and defect-free coatings and excellent
resolution.
* New products under development include Advanced SAP Metallization solutions
and CIRCUPOSIT 71 Full-Build Electroless Copper. These products are planned to
be commercially available next year.
"The strength of Dow Electronic Materials comes from our ability to closely
partner with industry-leading customers to develop next generation materials,"
said Bob Ferguson, global general manager for Dow Electronic Materials. "As a
leader in metallization technologies, we are excited to present these
high-performance, low-cost, and more sustainable solutions to the PCB industry.
With our cutting-edge technology, outstanding customer service, strong technical
support and global footprint, we are committed to deliver sustainable
technologies for the evolving electronic world," he said.
Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow.
About Dow
Dow is a diversified chemical company that combines the power of science and
technology with the "Human Element" to constantly improve what is essential to
human progress. The Company delivers a broad range of products and services to
customers in approximately 160 countries, connecting chemistry and innovation
with the principles of sustainability to help provide everything from fresh
water, food and pharmaceuticals to paints, packaging and personal care products.
In 2008, Dow had annual sales of $57.5 billion and employed approximately 46,000
people worldwide. The Company has 150 manufacturing sites in 35 countries and
produces approximately 3,300 products. On April 1, 2009, Dow acquired Rohm and
Haas Company, a global specialty materials company with sales of $10 billion in
2008, 98 manufacturing sites in 30 countries and approximately 15,000 employees
worldwide. References to "Dow" or the "Company" mean The Dow Chemical Company
and its consolidated subsidiaries unless otherwise expressly noted. More
information about Dow can be found at www.dow.com.
About Dow Electronic Materials
Dow Electronic Materials, a global supplier of materials and technologiesto the
electronics industry, brings innovative leadership to the semiconductor,
interconnect, finishing, photovoltaic, display, LED and optics markets. From
advanced technology centers worldwide, teams of talented Dowresearch scientists
and application experts work closely with customers, providing solutions,
products and technical service necessary for next-generation electronics. These
partnerships energize Dow`s power to invent. Its key end-use applications
include a broad range of consumer electronics from personal computers, to
television monitors, cellular phones, global positioning systems, automobile
safety systems, and avionics.
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Media Contact:
Dow Electronic Materials
Elysia Hsieh, +886-37-539158
elysiahsieh@rohmhaas.com
Copyright Business Wire 2009
