Also Adds Small Size 8GB, 16GB and 32GB Flash Modules for Netbooks to Enhanced
Line-up
IRVINE, Calif., and TOKYO, Sept. 25 /PRNewswire/ -- Toshiba Corp. (Toshiba)
and Toshiba America Electronic Components, Inc. (TAEC)*, its subsidiary in the
Americas, today announced enhancements to their line up of NAND-flash-based
solid state drives (SSD) with the addition of an industry-leading 256-gigabyte
(GB)(1) SSD and the launch of small-sized Flash Modules for netbook computers,
ultra-mobile PCs (UMPCs) and other mobile and peripheral applications. The new
drives will be showcased at CEATEC in Makuhari, Japan, from September 30 to
October 4.
Samples of both the 256GB SSD and the Flash Modules are available now, with
mass production following in the fourth quarter (October to December) of the
year.
Toshiba's new high density SSD brings 256GB of capacity to a 2.5-inch drive
form factor with an advanced Multi-level Cell (MLC) controller that achieves
higher read-write speeds, parallel data transfers and wear leveling to
optimize performance, reliability and endurance. Alongside this, Toshiba
provides support for the growing market for small, netbook computers, UMPCs
and other personal equipment with the launch of small SSD Flash Modules
supporting 8GB, 16GB and 32GB densities.
The new 256GB SSD mounts NAND flash memory on a 70.6mm (L) x 53.6mm (W) x
3.0mm (H) platform. The drive offers performance characteristics essential for
today's mainstream notebook PCs: highly reliable, high density data storage
and support for fast data transfer rates, with a maximum read speed of 120MB
per second (MBps)(2) and maximum write speed of 70MBps, via a SATA 3.0Gb per
second (Gbps)(3) interface.
Flash Modules are fabricated on a 50mm x 30mm platform, and offer maximum read
and write speeds of 80MB and 50MB per second(2), respectively. Flash Modules
are also compatible with the SATA interface and will support continued
development of the fast growing market for netbook PCs, UMPCs and mobile and
peripheral applications by offering developers a wider range of SSD for
integration in differentiated products.
Toshiba will continue to promote innovations that widen the horizons of the
NAND Flash market and support its continued leadership in that market. The
company will spur demand for SSD in notebook PCs, laptops and digital consumer
products by enhancing its lineup, offering products with different densities
and interfaces in a range of packages, while advancing device performance. For
more information on Toshiba SSDs, please visit ssd.toshiba.com.
Outline of the new products
Type Product Number Capacity Samples Start of Mass
Production
256GB SSD THNS256GE8BC 256GB Sep., 2008 4Q, 2008
2.5-inch SATA
Flash Module THNSA08G0P4L 8GB Sep., 2008 4Q, 2008
SATA THNSA16G1P4L 16GB Sep., 2008 4Q, 2008
THNSA32G1P4L 32GB Sep., 2008 4Q, 2008
Product specification
256GB SSD
Interface Serial ATA-2 (3Gbps)
Voltage 5V (2.5-inch type)
Reading speed Maximum speed 120MBps (sequential mode)
Writing speed Maximum speed at 70MBps (sequential mode)
Temperature 0 to 70 degrees Celsius
Flash Module
Interface Serial ATA-2 (3Gbps)
Voltage 5V
Reading speed Maximum speed at 80MBps (sequential mode)
Writing speed Maximum speed at 50MBps (sequential mode)
Temperature 0 to 70 degrees Celsius
*About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable
electronic components, Toshiba enables its customers to create market-leading
designs. Toshiba is the heartbeat within product breakthroughs from OEMs,
ODMs, CMs, distributors and fabless chip companies worldwide. A committed
electronic components leader, Toshiba designs and manufactures high-quality
flash memory-based storage solutions, discrete devices, displays, advanced
materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging
products, microcontrollers and wireless components that make possible today's
leading cell phones, MP3 players, cameras, medical devices, automotive
electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating
company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation,
Japan's largest semiconductor manufacturer and the world's third largest
semiconductor manufacturer (Gartner, 2007 WW Semiconductor Revenue, April
2008). For additional company and product information, please visit
http://www.toshiba.com/taec/.
Information in this press release, including product pricing and
specifications, content of services and contact information, is current and
believed to be accurate on the date of the announcement, but is subject to
change without prior notice. Technical and application information contained
here is subject to the most recent applicable Toshiba product specifications.
In developing designs, please ensure that Toshiba products are used within
specified operating ranges as set forth in the most recent Toshiba product
specifications and the information set forth in Toshiba's "Handling Guide for
Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This
information is available at www.chips.toshiba.com, or from your TAEC
representative.
(1) When used herein in relation to memory density, gigabyte and/or GB means
1,024x1,024x1,024 = 1,073,741,824 bytes. Usable capacity may be less. For
details, please refer to specifications.
(2) For purposes of measuring read and write speed in this context, 1 Megabyte
or MB = 1,000,000 bytes. Read and write speed may vary depending on the
controller, read and write conditions, such as file sizes you read and/or
write.
(3) For purposes of measuring read and write speed in this context, 1 Gigabit
or Gb = 1,000,000,000 bits. Read and write speed may vary depending on the
controller, read and write conditions, such as file sizes you read and/or
write.
SOURCE Toshiba America Electronic Components, Inc.
Rebecca Bueno of Toshiba America Electronic Components, Inc., +1-949-623-3098,
rebecca.bueno@taec.toshiba.com; or agency, Jan Johnson of MultiPath
Communications, +1-714-633-4008, jan@multipathcom.com, for Toshiba America
Electronic Components, Inc.
