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Hynix to sell back-end equipment to China venture

Sun May 17, 2009 8:16pm EDT

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SEOUL, May 18 (Reuters) - Hynix Semiconductor Inc (000660.KS) said on Monday it would sell packaging and testing equipment worth $305 million to a soon-to be formed back-end joint venture in China.

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"Hynix will more focus on the core business of front-end manufacturing and extend R&D investment to the fullest," the world's second-largest maker of computer memory chips said in a statement.

(Reporting by Rhee So-eui and Marie-France Han; editing by Jonathan Hopfner)

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