Elpida says to outsource chips to Taiwan's Winbond

TOKYO, Nov 11 (Reuters) - Japanese DRAM maker Elpida Memory (6665.T) said on Wednesday it will outsource production to Taiwan's Winbond Electronics Corp (2344.TW) in a bid to gain technological clout over U.S. rival Micron (MU.N).

Elpida, which last week announced a similar outsourcing agreement with Taiwan's ProMOS (5387.TWO), has been seeking allies as it chases South Korea's Samsung Electronics (005930.KS) and Hynix Semiconductor (000660.KS) for market share. [ID:nT213504]

The Nikkei business daily said Elpida will supply 65-nanometre chip technology to Winbond, and is likely to outsource production worth roughly 20,000 to 30,000 300-mm wafers per month to Winbond.

(Reporting by Mayumi Negishi)