Tessera to Present at International Symposium on Microelectronics

http://www.businesswire.com/news/home/20091027005395/en

SAN JOSE, Calif.--(Business Wire)--
Tessera Technologies, Inc. (Nasdaq:TSRA) will participate in a series of panels
and technical sessions at the International Symposium on Microelectronics
(IMAPS) in San Jose, Calif.:

WHAT: Advanced Materials Panel
Panel Co-Chair: Y. Zhang, senior engineer, R&D, Tessera
November 3rd @ 8:00 a.m.

Design for Reliability Panel
Paper: Design and Reliability of µPILR Package-on-Package (PoP)
Panel Co-Chair and Presenter: I. Mohammed, director of Packaging Development, Tessera
November 4th @ 1:35 p.m.

Flip-Chip and Wafer Bumping: Processes and Reliability Panel
Panel Co-Chair: B. Banijamali, senior engineer, Mechanical Engineering, Tessera
Paper: Electromigration Study of Fine-Pitch Flip-Chip Interconnect Technology
Presenter: I. Mohammed
November 5th @ 8:00 a.m.

WHERE: 42nd International Symposium on Microelectronics
San Jose Convention Center, San Jose, CA

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant
to the safe harbor provisions of the Private Securities Litigation Reform Act of
1995. Forward-looking statements involve risks and uncertainties that could
cause actual results to differ significantly from those projected, particularly
with respect to Tessera's participation in the International Symposium on
Microelectronics and the subject matter of any Tessera presentation or
discussion at the symposium. Material factors that may cause results to differ
from the statements made include delays, setbacks or losses relating to our
intellectual property or intellectual property litigations, or any invalidation
or limitation of our key patents; fluctuations in our operating results due to
the timing of new license agreements and royalties, or due to legal costs;
changes in patent laws, regulation or enforcement, or other factors that might
affect our ability to protect our intellectual property; the risk of a decline
in demand for semiconductor products; failure by the industry to adopt our
technologies; competing technologies; the future expiration of our patents; the
future expiration of our license agreements and the cessation of related royalty
income; the failure or refusal of licensees to pay royalties; failure to achieve
the growth prospects and synergies expected from acquisition transactions; and
delays and challenges associated with integrating acquired companies with our
existing businesses. You are cautioned not to place undue reliance on the
forward-looking statements, which speak only as of the date of this release.
Tessera's filings with the Securities and Exchange Commission, including its
Annual Report on Form 10-K for the year ended December 31, 2008 and its
Quarterly Report on Form 10-Q for the quarter ended June 30, 2009, include more
information about factors that could affect the company's financial results.
Tessera assumes no obligation to update information contained in this press
release. Although this release may remain available on Tessera's website or
elsewhere, its continued availability does not indicate that Tessera is
reaffirming or confirming any of the information contained herein.

About Tessera

Tessera Technologies, Inc., invests in, licenses and delivers innovative
miniaturization technologies for next-generation electronic devices. The
company`s micro-electronics solutions enable smaller, higher-functionality
devices through chip-scale, 3D and wafer-level packaging technology, as well as
high-density substrate and silent air cooling technology. Tessera`s imaging and
optics solutions provide low-cost, high-quality camera functionality in
electronic products and include image sensor packaging, wafer-level optics and
image enhancement intellectual property. The company also offers customized
micro-optic lenses, from diffractive and refractive optical elements to
integrated micro-optical subassemblies. Tessera licenses its technologies, as
well as delivers products based on these technologies, to promote the
development of the supply chain infrastructure. The company is headquartered in
San Jose, California. For information call 1.408.321.6000 or go to
www.tessera.com.

Tessera, the Tessera logo and μPILR are trademarks or registered trademarks of
Tessera, Inc. or its affiliated companies in the United States and other
countries. All other company, brand and product names may be trademarks or
registered trademarks of their respective companies.

TSRA-G

Tessera
Judy Erkanat, +1-408-321-6751
jerkanat@tessera.com
or
LEWIS PR for Tessera
Catherine Koo or Nicole Wasowski, +1-415-992-4400
Tessera@lewispr.com

Copyright Business Wire 2009