Samsung's Single-Chip Mobile TV Channel Decoder RF SoC Supports Global TV Standards...

Samsung's Single-Chip Mobile TV Channel Decoder RF SoC Supports Global TV Standards for Cell Phones

BARCELONA, Spain--(Business Wire)--
Samsung Electronics Co., Ltd., a leader in advanced semiconductor
technology, unveiled today the S3C4F60, a 65nanometer (nm) single-chip
mobile TV System-on-Chip (SoC) which combines a channel decoder with
an RF chip. Samsung's new S3C4F60 supports all worldwide TV standards
with respect to frequency range and channel bandwidth, giving
consumers the ability to enjoy real-time news, sports, weather
forecasts, and live entertainment anywhere.

Samsung's suite of advanced products for portable consumer
applications will be on display at the Mobile World Congress 2008 in
Hall 1, Booth #D33, of the Fira de Barcelona, Montjuic.

"As consumers begin to embrace mobile TV, mobile service providers
and telecommunication carriers will increase their offerings in a
variety of new services aimed at improving customer retention and
building new revenue streams," said Yiwan Wong, vice president,
Marketing Team, System LSI Division, Semiconductor Business, Samsung
Electronics. "Samsung's S3C4F60 is the most advanced mobile TV
receiver solution in the market in providing device manufacturers the
flexibility to support the most popular mobile TV standards and
broadcast frequency spectrums around the world using a single
platform."

Samsung's new receiver chip supports six different mobile TV
standards and complies with all related specifications of DVB-H/T
(ETSI EN 300 744, EN 302 304, EN 301 192 and MBRAI); ISDB-T (ARIB-B29/
B31 1/ 3-Seg); T-DMB (Korean T-DMB, DAB (Eureka-147)); and DAB/ DAB-IP
standards. The integrated built-in multi-band RF tuner supports VHF
III (174-240 MHz), UHF (470-862 MHz), and L-bands (1350-1750 MHz).

Samsung's S3C4F60 also offers a significant boost in mobile
performance. By achieving 180 Hz Doppler frequency performance at
DVB-H 16 QAM, 8 K, 2/3 CR, and 1/4 GI, mobile TV products using the
S3C4F60 can achieve perfect reception of digital TV signals, even
inside high-speed trains like the TGV, ICE, or Shinkansen traveling at
speeds of up to 300Km/hour.

Fabricated in Samsung's advanced 65nm process and housed in a tiny
5x5mm wafer level chip scale package (WL-CSP) to minimize the
footprint, Samsung's new S3C4F60 integrates into a single chip a low
noise amplifier (LNA), embedded SRAM, analog-to-digital converter
(ADC), PLL, CPU (ARM 7) and a low drop-out (LDO), thereby greatly
reducing the number of external components needed.

According to the market research firm Strategic Analytics, the
mobile TV market is expected to reach 24 million units in 2008 and 133
million units by 2011, for a compounded annual growth rate of 67
percent.

Samsung's S3C4F60 is scheduled for mass production in the third
quarter of 2008 and samples will be available from March 2008.

About Samsung Electronics

For more information, please visit www.samsung.com or
www.samsung.com/us/business/semiconductor/news/News_MediaCenter.html.

Samsung Semiconductor
Lisa Warren-Plungy, 408-544-5377
lwarrenplungy@ssi.samsung.com

Copyright Business Wire 2008