Press Release Updated With Corrected Details in Regards to FEI's Announcement About...

Press Release Updated With Corrected Details in Regards to FEI's Announcement
About the Helios NanoLab 1200 Full Wafer DualBeam System

HILLSBORO, Ore., July 13, 2009 (GLOBE NEWSWIRE) -- FEI Company (Nasdaq:FEIC), a
leading provider of atomic-scale imaging and analysis systems, today announced
the newest member of the Helios NanoLab(tm) family -- the Helios NanoLab 1200
Full Wafer DualBeam(tm) system. The ability of the Helios NanoLab 1200 to
analyze full wafers up to 300 mm improves the efficiency of semiconductor and
data storage failure analysis and manufacturing support labs that need to
deliver accurate data quickly to the production floor.

"We've designed the new Helios NanoLab 1200 DualBeam system to provide high
productivity for failure analysis, process development and process control
requirements," said Larry Dworkin, product marketing manager for FEI's full
wafer systems. "The ability to introduce full wafers directly into the system
allows users to navigate quickly to multiple features of interest based on
design data or information from other inspection and defect detection tools.
Fast switching between imaging and milling permits precise, efficient control of
the cross sectioning process. Additionally, the system's imaging resolution is
better than any other instrument in its class, which ensures superior analytical
results."

The Helios NanoLab 1200 combines world-class scanning electron microscope (SEM)
image resolution and fast switching between imaging and ion beam milling to
deliver rapid, reliable, efficient cross-sectional analysis of structures and
defects. Its ability to accommodate full wafers up to 300 mm eliminates the time
required to re-establish the navigational coordinate system when working with
wafer pieces.

"In the nearly two years since its introduction, our small-chamber Helios
NanoLab DualBeam systems have been installed at every leading edge fab in the
world," said Rudy Kellner, vice president and general manager of FEI's
Electronics Market Division. "Now, for the first time, we can offer the same
performance in a full wafer system."

When the analysis demands the higher resolution capability of a dedicated
scanning transmission electron microscope (S/TEM), FEI's MultiLoader(tm)
technology enables fast and secure lamellae sample transfer. FEI's new
automation software product, iFAST(tm), improves the quality and consistency of
multiple, site-specific samples in a single session. Optional energy dispersive
X-ray spectrometry (EDS) on thin samples offers compositional analysis of
defects and structures.

The new Helios NanoLab 1200 DualBeam system is available for ordering
immediately.

About FEI

FEI (Nasdaq:FEIC) is a leading diversified scientific instruments company. It is
a premier provider of electron and ion-beam microscopes and tools for nanoscale
applications across many industries: industrial and academic materials research,
life sciences, semiconductors, data storage, natural resources and more. With a
60-year history of technological innovation and leadership, FEI has set the
performance standard in transmission electron microscopes (TEM), scanning
electron microscopes (SEM) and DualBeams(tm), which combine a SEM with a focused
ion beam (FIB). FEI's imaging systems provide 3D characterization, analysis and
modification/prototyping with resolutions down to the sub-Angstrom (one-tenth of
a nanometer) level. FEI's NanoPorts in North America, Europe and Asia provide
centers of technical excellence where its world-class community of customers and
specialists collaborate. FEI has approximately 1800 employees and sales and
service operations in more than 50 countries around the world. More information
can be found at: www.fei.com.

The FEI Company logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6379

FEI Safe Harbor Statement

This news release contains forward-looking statements that include statements
regarding the performance capabilities and benefits of the Helios NanoLab 1200
Full Wafer DualBeam system. Factors that could affect these forward-looking
statements include but are not limited to delay or cancellation of additional
development work to move the product from beta to release, technical problems
arising during the beta phase, problems with our suppliers, delays in releasing
the product, failure of the product or technology to perform as expected and
achieve anticipated results, unexpected technology problems and our ability to
manufacture, ship and deliver the tools as expected. Please also refer to our
Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and
Exchange Commission for additional information on these factors and other
factors that could cause actual results to differ materially from the
forward-looking statements. FEI assumes no duty to update forward-looking
statements.

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