Optomec and Vertical Circuits Partner to Develop Ultra-Fine Pitch 3D Interconnect Solution

Aerosol Jet Will Enable Advanced Multi-Chip Packages for Mobile Product
Applications
ALBUQUERQUE, N.M.--(Business Wire)--
Optomec, Inc. and Vertical Circuits, Inc. (VCI) announced today that they are
collaborating in the development of a high density 3-dimensional interconnect
solution that will enable multi-functional integrated circuits to be stacked and
vertically interconnected in high performance Multi-Chip Packages (MCPs). The
solution will combine the unique fine feature capabilities of Optomec`s patented
Aerosol Jet® material deposition system with the cost and functional benefits of
VCI`s patented Conformal Interconnect Technology, used currently in high density
memory components and removable storage cards. The result will uniquely enable
the combination of multiple memory devices plus logic and mixed signal ASICs
into single packages with electrical/thermal performance, size, and cost
benefits over alternative 3D technologies.

The solution is initially targeted to meet the continuing miniaturization needs
of mobile communications product manufacturers, and will ultimately impact a
broad range of devices that require cost-effective, high performance, and small
form factor component solutions. As part of the collaboration, Optomec has
installed one of its standard systems at VCI, and the two companies are working
closely together to optimize the solution for production in 2010.

Simon McElrea, Vertical Circuits' Product Development VP, stated, "Vertical
Circuits' approach is to simplify the 3D product solution. Our unique
interconnect technology and process flow have been developed to significantly
reduce the manufacturing complexity vs. traditional wire-bond and
package-on-package (PoP) based solutions. Our conformal interconnect technology
minimizes the package form factor and provides a short, high performance signal
path without the need to wait for complex TSV-based solutions. We are delighted
to be working with Optomec, the leader in fine conductor application tools."

The Aerosol Jet solution is ideally suited for production of fine pitch 3D
conformal interconnects, since it is the only cost-effective technology capable
of producing highly conductive traces as small as 10 micron over complex die
stack geometries. Traditional multi-die packaging interconnect solutions such as
Wire Bonding and PoP are complex and costly, and have limited scalability to
support the higher frequency/short path signals required for next generation
portable devices. Similarly, cost and time-to-market concerns remain a
significant issue for emerging alternatives such as Through Silicon Via (TSV).

Dave Ramahi, Optomec President/CEO, commented that "We are delighted to work in
close partnership with VCI to introduce this high value chip packaging solution.
As a near-term, low-cost alternative to the future promise of Through Silicon
Via, we believe our solution will soon see demand well beyond the needs of our
initial mobile communications product applications."

To download a video of the printing of vertical interconnects and other
information, click here.

VCI is a global supplier of advanced die level vertical interconnect packaging
technology, products, services and intellectual property for the manufacture of
low cost ultra high-speed/high-density semiconductor components. VCI develops
cost effective advanced interconnect technology for high density and high
performance applications. Their patented ViP (Vertical Interconnect Pillar)
process bridges the gap between current wire bond based product solutions and
tomorrow`s Through Silicon Via (TSV) technology. For more information on VCI,
please visit their website at www.verticalcircuits.com.

Optomec is the world-leading provider of additive manufacturing systems for
high-performance applications in the Photovoltaic, Electronics, Biomedical, and
Aerospace & Defense markets. These systems utilize Optomec`s proprietary Aerosol
Jet printed electronics and LENS powder-metal fabrication technologies. The
company has a global customer base of industry-leading manufacturers. For more
information on Optomec`s Aerosol Jet deposition system and VCI, visit us at
Intersolar/SEMICON West in booth #8363.

Optomec
Shayna Watson, 505-761-8250
swatson@optomec.com
www.optomec.com

Copyright Business Wire 2009