TSMC Joins the CEA-Leti Program on Multiple E-Beam Lithography for IC Manufacturing

HSINCHU, Taiwan & GRENOBLE, France--(Business Wire)--
TSMC (TWSE: 2330, NYSE: TSM) and CEA-Leti, the leading French semiconductor
research institute, signed an agreement today in which TSMC will join the new
industrial program IMAGINE, led by CEA-Leti, on maskless lithography for IC
manufacturing. Intended to operate for three years, this program allows
companies to assess a maskless lithography infrastructure for IC manufacturing
and use MAPPER Technology as a solution towards high throughput. It covers a
global approach, including tool assessment, patterning and process integration,
data handling, prototyping and cost analysis.

"TSMC is always pushing for cost-effective lithography and the development of
maskless lithography is one of the potential solutions. We have already
announced the joint steps with Mapper to explore multiple e-beam lithography for
IC manufacturing at 22 nanometer node and beyond," said TSMC`s VP of R&D, Jack
Sun. "By joining the IMAGINE program at CEA-Leti, we intend to federate the
semiconductor industry around this technology and accelerate its development and
introduction for IC manufacturing."

"Lithography is a major challenge for the industry. A maskless approach can
offer flexibility and gain in cost of ownership. Together with MAPPER, we see a
route towards industrial throughput," said Leti`s CEO, Laurent Malier. "Having
TSMC on board the IMAGINE program is pivotal and will strengthen the assessment
towards manufacturing. It shows the commitment in the technology from the
industry and will take maskless lithography to the next step in the development
that is required to make it a viable solution for 22-nm manufacturing."

About TSMC:

TSMC is the world`s largest dedicated semiconductor foundry, providing the
industry`s leading process technology and the foundry`s largest portfolio of
process-proven libraries, IP, design tools and reference flows. The Company`s
total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers,
including capacity from two advanced 12-inch - GIGAFABs , four eight-inch fabs,
one six-inch fab, as well as TSMC`s wholly owned subsidiaries, WaferTech and
TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry to
provide 40nm production capabilities. Its corporate headquarters are in Hsinchu,
Taiwan. For more information about TSMC please visit http://www.tsmc.com.

About CEA-Leti:

CEA is a French Research and Technology Organisation, with activities in three
main areas: Energy, Technologies for Information and Healthcare, and Defence and
Security. Within CEA, the Laboratory for Electronics & Information Technology
(CEA-Leti) works with companies in order to increase their competitiveness
through technological innovation and transfers. Leti is focused on micro and
nanotechnologies and their applications, from wireless devices and systems, to
biology and healthcare or photonics. Nanoelectronics and Microsystems (MEMS) are
at the core of its activities. As a major player in MINATEC excellence centre,
Leti operates 8,000 m² state-of-the-art clean rooms, on 24/7 mode, on 200 mm and
300 mm wafer standards. With 1,200 employees, Leti trains more than 150 Ph.D.
students and hosts 200 assignees from partner companies. Strongly committed to
the creation of value for the industry, Leti puts a strong emphasis on
Intellectual Property and owns more than 1,400 patent families. In 2008,
contractual income covered more than 75% of its budget worth 205 M€. For more
information, visit www.leti.fr.

TSMC Contacts:
Wendy Matthews
Phone: 408-382-8030
Email: wmatthews@tsmc.com
or
Michael Kramer
Phone: +886-3-5636688 ext: 7126216
Email : pdkramer@tsmc.com
or
CEA-LETI Contacts:
Serge Tedesco
Phone: +33 4 38 78 49 89
Email: serge.tedesco@cea.fr
or
Clément Moulet
Phone: +33 4 38 78 03 26
Email: clement.moulet@cea.fr

Copyright Business Wire 2009