TSMC Joins the CEA-Leti Program on Multiple E-Beam Lithography for IC Manufacturing

TSMC Joins the CEA-Leti Program on Multiple E-Beam Lithography for IC
Manufacturing

HSINCHU, Taiwan and GRENOBLE, France, July 6 /PRNewswire-FirstCall/ -- TSMC
(TWSE: 2330; NYSE: TSM) and CEA-Leti, the leading French semiconductor
research institute, signed an agreement today in which TSMC will join the new
industrial program IMAGINE, led by CEA-Leti, on maskless lithography for IC
manufacturing. Intended to operate for three years, this program allows
companies to assess a maskless lithography infrastructure for IC manufacturing
and use MAPPER Technology as a solution towards high throughput. It covers a
global approach, including tool assessment, patterning and process
integration, data handling, prototyping and cost analysis.

"TSMC is always pushing for cost-effective lithography and the development of
maskless lithography is one of the potential solutions. We have already
announced the joint steps with Mapper to explore multiple e-beam lithography
for IC manufacturing at 22 nanometer node and beyond," said TSMC's VP of R&D,
Jack Sun. "By joining the IMAGINE program at CEA-Leti, we intend to federate
the semiconductor industry around this technology and accelerate its
development and introduction for IC manufacturing."

"Lithography is a major challenge for the industry. A maskless approach can
offer flexibility and gain in cost of ownership. Together with MAPPER, we see
a route towards industrial throughput," said Leti's CEO, Laurent Malier.
"Having TSMC on board the IMAGINE program is pivotal and will strengthen the
assessment towards manufacturing. It shows the commitment in the technology
from the industry and will take maskless lithography to the next step in the
development that is required to make it a viable solution for 22-nm
manufacturing."

About TSMC:
TSMC is the world's largest dedicated semiconductor foundry, providing the
industry's leading process technology and the foundry's largest portfolio of
process-proven libraries, IP, design tools and reference flows. The Company's
total managed capacity in 2008 exceeded 9 million 8-inch equivalent wafers,
including capacity from two advanced 12-inch - GIGAFABs(TM), four eight-inch
fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech
and TSMC (China), and its joint venture fab, SSMC. TSMC is the first foundry
to provide 40nm production capabilities. Its corporate headquarters are in
Hsinchu, Taiwan. For more information about TSMC please visit
http://www.tsmc.com.

About CEA-Leti:
CEA is a French Research and Technology Organisation, with activities in three
main areas: Energy, Technologies for Information and Healthcare, and Defence
and Security. Within CEA, the Laboratory for Electronics & Information
Technology (CEA-Leti) works with companies in order to increase their
competitiveness through technological innovation and transfers. Leti is
focused on micro and nanotechnologies and their applications, from wireless
devices and systems, to biology and healthcare or photonics. Nanoelectronics
and Microsystems (MEMS) are at the core of its activities. As a major player
in MINATEC excellence centre, Leti operates 8,000 m(2) state-of-the-art clean
rooms, on 24/7 mode, on 200 mm and 300 mm wafer standards. With 1,200
employees, Leti trains more than 150 Ph.D. students and hosts 200 assignees
from partner companies. Strongly committed to the creation of value for the
industry, Leti puts a strong emphasis on Intellectual Property and owns more
than 1,400 patent families. In 2008, contractual income covered more than 75%
of its budget worth 205 M€. For more information, visit www.leti.fr.

SOURCE TSMC

TSMC Contacts: Wendy Matthews, +1-408-382-8030, wmatthews@tsmc.com, or
Michael Kramer, +886-3-5636688, Ext: 7126216, pdkramer@tsmc.com; or CEA-LETI
Contacts: Serge Tedesco, +33-4-38-78-49-89, serge.tedesco@cea.fr, or Clement
Moulet, +33-4-38-78-03-26, clement.moulet@cea.fr