AMEC Enters Semiconductor Capital Equipment Market With Portfolio of Advanced Process...

AMEC Enters Semiconductor Capital Equipment Market With Portfolio of Advanced
Process Tools
Asia-Based Company's Proprietary Technologies Deliver Superior On-Wafer
Performance, Higher Productivity and Cost-of-Ownership Benefits

TOKYO, Dec. 3 /PRNewswire/ -- Advanced Micro-Fabrication Equipment Inc.
(AMEC) today launched its official entry into the global semiconductor capital
equipment market with a portfolio of leading-edge process tools for the 65-
45nm nodes and beyond. The Asia-based provider of proprietary technology
solutions unveiled the Primo D-RIE(TM) (decoupled reactive ion etch) system
for critical and other dielectric etch applications and the Primo HPCVD(TM)
(high-pressure chemical vapor deposition) system for shallow trench isolation
(STI) and pre-metal dielectric deposition.
The Primo systems feature advanced technology innovations and a unique
chamber design that delivers high on-wafer performance, very low defects, and
high throughput. At the heart of each tool is a novel mini-batch cluster
architecture that improves productivity by more than 35 percent over
comparative systems, while offering a 35 percent lower cost-of-ownership (CoO)
benefit. Two systems have already been shipped. They were installed and
fully operational in a record 7 days, far outmatching the industry average.
Several more systems are ready to ship to leading-edge semiconductor fabs in
Asia.
AMEC's official debut reflects a growing trend of new, Asia-based capital
equipment companies poised to serve a semiconductor manufacturing industry
that has increasingly shifted to Asia. For these new suppliers, an Asia-based
location not only affords closer geographic and cultural proximity to
customers, it also provides access to skilled technical talent and experienced
semiconductor executives across the region. Moreover, it places these
critical vendors in the hub of a thriving local supply chain. These
advantages enable them to deliver advanced systems with leading
price/performance characteristics to customers that demand more value vs.
their spending on advanced process technology.
AMEC is among the first to leverage these advantages to innovate a
portfolio of high-value IP that forms the core of the Primo HPCVD and Primo
D-RIE systems. The tools were developed in two-and-a-half years-the result of
significant effort and innovation by distinguished semiconductor process
technology and engineering experts who form the technical backbone of AMEC's
global team. With a network of R&D, manufacturing, applications, business and
support centers located worldwide, including China, Japan, Korea, Singapore
and Taiwan, the company is well positioned from the outset to serve the
advanced processing needs of a global customer base.
According to Dean Freeman, research vice president with market research
firm, Gartner, Inc., "Sixty-six percent of all semiconductor device revenue is
consumed in Asia, making the Asia-Pacific region (including Japan) the
epicenter of semiconductor manufacturing.(1) Our data also shows that 75
percent of all capital expenditures for semiconductor manufacturing take place
in Asia, thus making it the hotbed for semiconductor equipment manufacturers
as well."(2)
"Achieving superior on-wafer performance and reducing our manufacturing
costs are key success factors for us," said Dr. Steve Tso, senior vice
president of Taiwan Semiconductor Manufacturing Company (TSMC). "It's
essential, therefore, for us to forge close partnerships with process tool
companies that are committed to providing advanced systems that meet or even
exceed our technology and economic requirements."
"With the semiconductor industry increasingly being driven by
price-sensitive consumers, cost of ownership is integral to chipmaker
success," said AMEC chairman and chief executive officer, Gerald Z. Yin. "At
the same time, manufacturers require ever-more advanced process technologies
and high-performing tools to keep pace with Moore's Law and deliver the chips
that enable the next generation of more powerful electronic devices. AMEC's
technology solutions with economic innovation are designed to meet these
requirements. And, our Asia business model also allows us to partner more
closely with customers while leveraging the cost advantages of the region.
We're very proud to bring our products to the global market."
AMEC's progress was enabled by a syndicate of high-profile global
investors. These elite firms, which include Walden International, Lightspeed
Venture Partners, and Goldman Sachs, among others, have funded the company's
technology development and now, the commercialization of its innovative
products. According to Chris Schaepe, General Partner of Lightspeed Venture
Partners, "AMEC typifies the new breed of Asia-based technology innovators
that are poised to serve a global market. Their expert team has a deep
understanding of the technical challenges facing chipmakers, together with the
business experience and technology capabilities to empower customers with
solutions that enable the production of advanced IC devices at the lowest
possible cost."
"Asia is home to some of the world's most innovative and advanced
technology companies," said Hsueh Sung, Vice Chairman of Goldman Sachs Asia.
"AMEC has demonstrated its leadership position in the semiconductor equipment
sector and we are excited to be partnering with the company as it continues to
expand."
According to Yin, "AMEC's investors have played a significant role in our
company's progress. Not only have they provided the financial resources to
develop and commercialize our technology, they also serve as indispensable
business advisors. We are deeply grateful for their support."
Advanced Technology Solutions with Economic Innovations
AMEC's Primo products are built to meet the higher productivity and
superior on-wafer-performance requirements of advanced-node semiconductor
processing. The product portfolio includes:
The Primo D-RIE system
The 300-mm Primo D-RIE system leverages a twin-station mini-batch cluster
system with a single-wafer environment and patented VHF decoupled RIE plasma
source designed to provide fine critical dimension control, high selectivity
to mask, wide process window, and robust and repeatable performance for
critical and other dielectric etch applications at nodes of 65-45 nm and
beyond. The applications include: VHAR, hard mask open, spacer, dual
damascene via and trench etches, among many others.
System Features & Technology Advantages

-- Decoupled, dual-frequency RIE with consistent RF path provides
effective CD control knobs and enables independent ion density and
energy control
-- Symmetrically distributed and direct RF feed for precise process
control and within-wafer etch rate uniformity
-- Proprietary, dual plasma confinement for process stability with high
flow conductance for wide process window
-- Independent RF generator, onboard uniformity control unit and endpoint
control per station enables each wafer to run in a single chamber
environment
-- Bottom-powered, high-frequency source enables stable, low pressure,
high plasma density strip to preserve low-k integrity
-- Proprietary, self-isolated RF match for quick and repeatable frequency
tuning capability
-- High purity, plasma-resistant chamber materials for near zero
defectivity and low cost of consumables
-- Direct resistive top electrode heating with close-loop control enables
precise and fast temperature control for consistent wafer processing
-- Mini-batch cluster with up to six single-wafer process stations
delivers excellent throughput with smaller foot print
-- Modular system architecture provides for easy installation and
maintenance

The Primo HPCVD System
The 300-mm Primo HPCVD system combines an innovative mini-batch cluster
system with a single-wafer processing environment and other novel technology
features to tackle shallow trench isolation (STI) and pre-metal dielectric
(PMD) applications at 65-45-nm nodes and beyond.
System Features & Technology Advantages

-- Patented MCD (multi-channel distribution) technology enables high
deposition rate, wide void-free gap-fill window and low particle
performance
-- Dynamic wafer heater stage enhances within-wafer (WIW) and
wafer-to-wafer (WTW) uniformity control for dopants and film thickness
-- Unique injector design reduces particle generation and provides higher
liquid flow rate
-- Mini-batch cluster with up to 12 single-wafer process stations delivers
excellent throughput with smaller foot print
-- Modular system architecture provides for easy installation and
maintenance

In parallel with its launch, AMEC will host an Advanced Technology
Symposium at SEMICON Japan on Wednesday, December 5th at the Hotel New Otani
Makuhari, from 2:00 p.m. to 5:00 p.m. The Symposium will feature
presentations by senior technical experts from several prominent Japanese
chipmakers. Seats are limited. To reserve a place, please RSVP to Sherry
Zhu, sherryzhu@amecnsh.com
About Advanced Micro-Fabrication Equipment Inc.
Advanced Micro-Fabrication Equipment Inc. (AMEC) is a leading Asia-based
semiconductor equipment company with a portfolio of proprietary wafer
fabrication solutions designed to advance technology, increase productivity
and reduce manufacturing costs for leading global semiconductor manufacturers.
Strategically headquartered in the hub of the semiconductor manufacturing
industry, AMEC's proprietary etch and chemical vapor deposition (CVD) systems
combine unique technology solutions with economic innovations for the 65/45-nm
nodes and beyond. AMEC's global infrastructure includes R&D, manufacturing,
business and support operations in China, Japan, Korea, Singapore and Taiwan.
To learn more about AMEC, please visit the company on the Internet at
www.amec-inc.com.
The Primo HPCVD and Primo D-RIE are trademarks of Advanced Micro-
Fabrication Equipment Inc.
(1) Gartner, Inc., "Forecast: Semiconductor Wafer Fab Equipment,
Worldwide, 4Q07 Update", by Klaus Rinnen et al, Oct. 6, 2007

(2) Gartner, Inc., "Semiconductor Forecast Worldwide: Forecast Database"
by Nolan Reilly et al, Aug. 29, 2007

SOURCE Advanced Micro-Fabrication Equipment Inc.

Company Contact, Robert W. Wu, Ph.D. of Advanced Micro-Fabrication Equipment
Inc., mobile, +1-858-717-0371, robertwu@amecnsh.com; or Agency Contact, Jane
Evans Ryan, mobile, +1-408-489-6391, jryan@mcapr.com, for Advanced
Micro-Fabrication Equipment Inc.