KLA-Tencor Introduces Complete Measurement Solution for Critical 45nm Wafer Geometry...

KLA-Tencor Introduces Complete Measurement Solution for Critical 45nm Wafer Geometry Metrology Requirements

SAN JOSE, Calif.--(Business Wire)--KLA-Tencor (NASDAQ:KLAC) today introduced the WaferSight 2, the
semiconductor industry's first metrology system that enables wafer
suppliers and chipmakers to measure bare wafer flatness, shape, edge
roll-off and nanotopography in a single system with the high precision
and tool matching required for 45nm and beyond. With industry-leading
flatness and nanotopography precision, plus improved tool-to-tool
matching, WaferSight 2 enables leading-edge production of
next-generation wafers by wafer suppliers, and higher confidence of
incoming wafer quality control for IC makers.

Studies by leading lithography system suppliers have shown that
slight variations in wafer flatness can consume as much as 50% of the
critical lithography depth of focus budget at 45nm. Building on the
market leadership of KLA-Tencor's WaferSight 1 system, the fast and
accurate 45nm-generation flatness measurement capability of the
WaferSight 2 system can help both wafer makers and IC companies by
enabling tighter flatness specifications for bare wafers, helping
chipmakers overcome depth of focus challenges.

"At 45nm and beyond, variations in wafer flatness, shape and
surface topography can have a more severe impact on process windows
and yield for lithography and other manufacturing processes," said
Jeff Donnelly, vice president of Growth and Emerging Markets at
KLA-Tencor. "With improved optics and measurement isolation that
enable higher resolution, matching and precision compared to the
previous ADE WaferSight 1 system, the new WaferSight 2 helps wafer
makers dramatically tighten their manufacturing specs to meet 45nm
requirements, and also permits chipmakers to measure incoming wafers
in order to ensure process quality for manufacturing. At the same
time, the system's productivity reduces operating cost and improves
efficiency."

Nanotopography control has become critical at the 45nm node
because it is a cause of reduced process margin in CMP and can cause
CD variation in lithography. The new WaferSight 2 system's
improvements in precision provide industry-leading nanotopography
measurement performance. It also is the first to measure both
frontside and backside nanotopography in a single, non-destructive
measurement.

By combining flatness and nanotopography in one system, the
WaferSight 2 enables shorter cycle times, reduced WIP queuing and move
times, smaller footprint, and more efficient facilities usage compared
to multiple tool solutions. WaferSight 2 can also be seamlessly
combined with KLA-Tencor's fab data management system FabVision(R),
creating a package that enables offline analysis of archived or
current metrology data, with fully customized charts and reports.

Christophe Maleville, vice president, SOI Products Platform at
Soitec, a beta site partner for the WaferSight 2, said, "Our
evaluation of the WaferSight 2 system demonstrated class-leading
performance for all of the tool's measurement modes, with excellent
long-term reproducibility and measurement stability. The system's
advanced capabilities make it suitable for 45nm-generation production
and WaferSight 2 has shown excellent reliability during the evaluation
beta period and in production. This metrology system has been accepted
for silicon and SOI production, and Soitec will make WaferSight 2 a
key system for wafer geometry metrology going forward."

About KLA-Tencor: KLA-Tencor is the world leader in yield
management and process control solutions for semiconductor
manufacturing and related industries. Headquartered in San Jose,
California, the Company has sales and service offices around the
world. An S&P 500 company, KLA-Tencor is traded on the NASDAQ Global
Select Market under the symbol KLAC. Additional information about the
Company is available at www.kla-tencor.com.

KLA-Tencor
Charles Lewis, 408-875-9037
Director, Global Public Relations
charles.lewis@kla-tencor.com

Copyright Business Wire 2007