Ralink Delivers Leading Edge 802.11n Plus Bluetooth 3.0 Combo for Mobile PCs

Best-In-Class 802.11n and Bluetooth 3.0+HS with Unprecedented Performance,
Features, and Integration
HSINCHU, Taiwan--(Business Wire)--
Ralink Technology, a leading developer of high performance wireless solutions,
today announced availability of its RT3090BC4, an 802.11n plus Bluetooth 3.0
Half MiniCard solution for PC OEMs. Targeting Notebooks, Netbooks and
high-volume consumer PC platforms, the RT3090BC4 delivers an unprecedented level
of intelligent coexistence between Wi-Fi and Bluetooth. With support for
high-performance Bluetooth 3.0 + HS functionality, this product catapults
wireless mobile computing into a new level of multimedia capability by enabling
Bluetooth 3.0+HS and data rates of up to 150Mbps, while maintaining the
simplicity of Bluetooth device detection and setup. With an optimized bill of
material, simplified design, and integrated manufacturing and testing
procedures, the joint solution delivers significantly lower cost and power than
discrete Wi-Fi and Bluetooth products.

The growing popularity of slim, ultra-compact mobile PCs has sparked demand for
highly-integrated, co-located wireless solutions. To ensure optimal radio
coexistence between WLAN and Bluetooth, the RT3090BC4 combo solution
incorporates a sophisticated coexistence algorithm for improved harmony between
co-located WLAN and Bluetooth radios. It dynamically adjusts WLAN and Bluetooth
transmissions to reduce interference, and it responds automatically to the
presence and operating characteristics of nearby Wi-Fi Access Points. This
results in 80 percent faster WLAN throughput compared to competing WLAN plus
Bluetooth combo devices for PCs.

The RT3090BC4 is a highly integrated solution that eliminates redundant
components required for discrete 802.11n and Bluetooth modules including
antennas, connectors, printed circuit boards, cables, and radio shielding,
delivering more than 20 percent cost savings over competing WLAN plus Bluetooth
combo products. PC OEMs also benefit from reduced manufacturing costs through
easier assembly, faster testing, and simpler inventory control.

The RT3090BC4 supports the final 802.11n standard as well as Bluetooth 3.0 + HS,
the leading-edge version of Bluetooth which was announced earlier this year. The
solution incorporates support for Motorola`s consumer-friendly user interface
and 22 Bluetooth profiles including high-performance multimedia capabilities
such as stereo audio, video streaming, and rapid digital photo transfers for
personal area network (PAN) applications.

Ralink`s 802.11n technology is shipping in more than 650 products from customers
in the Americas, Europe, and Asia, and across all major Wi-Fi market segments
including personal computers, retail access points and adapters, DSL and cable
modem gateways, televisions, Blu-Ray players, web cameras, digital photo frames,
and IPTV set-top-boxes. Dozens of customers across these segments ship WLAN
products using Ralink`s innovative, high-performance Wi-Fi CERTIFIED 802.11n
chipsets. "Ralink' Wi-Fi solutions are featured in millions of desktop and
portable PCs worldwide, as well as the entire ecosystem of WLAN products
including retail networking devices," said Dr. Horen Chen, President of Ralink
Technology, "The RT3090BC4 WLAN/Bluetooth combo solution enables manufacturers
to quickly move into the new Bluetooth 3.0 + HS era and increase revenues."

MSI is among the first PC OEMs to adopt Ralink`s 802.11n plus Bluetooth combo
solution. "We are pleased to expand our partnership with Ralink into the fast
growing mobile PC market," said Jean Huang, Senior VP of MSI. "With its advanced
R&D and early investment in the `next generation` of Bluetooth/Wi-Fi co-location
technology, Ralink is far ahead of its competition with this first-shipping High
Speed Bluetooth + 802.11n module for PCs. Once again Raink has demonstrated that
it is at the forefront of the PC wireless components market, with high
performance, reliable, and cost-effective Wi-Fi technology," Huang added.

About Ralink Technology

Ralink Technology Corporation is a leading innovator and developer of wireless
chipset solutions. Ralink products are recognized for the superior throughput,
extended range, low-power consumption and consistent reliability required for
Wi-Fi, mobile and embedded applications. These feature-rich chipsets have a high
level of chip integration, enabling customers to build smaller and more
sophisticated mobile wireless products cost-effectively. Ralink`s patented
MIMObility technology extends Wi-Fi applications from traditional PC networking
to a range of digital multimedia and handheld devices including cell phones,
PDAs, cameras, print servers, HDTV and video game players. Ralink customers can
look forward to continuous improvements in speed, bandwidth and reliability with
IEEE 802.11n solutions for next-generation high-performance Wi-Fi. Ralink
Technology was founded in 2001 with headquarters in Hsin-chu, Taiwan and an R&D
center in Cupertino, California. For more information, visit Ralink at
www.ralinktech.com.

Ralink, Ralink Technology and MIMObilityTM are Ralink`s registered trademarks;
All other trademarks mentioned in this document are the property of their
respective owners.

Ralink Technology
Max Hsu, +886-3-560868 ext 1607
max_hsu@ralinktech.com.tw

Copyright Business Wire 2009