Tessera Licenses Consumer Optics Technologies to Nemotek

Combination of Tessera OptiML Wafer-Level Camera Technology and
SHELLCASE Wafer-Level Packaging to Enable Next-Generation Camera
Solutions
SAN JOSE, Calif.--(Business Wire)--Tessera Technologies, Inc. (Nasdaq:TSRA), a leading provider of
miniaturization technologies for the electronics industry, today
announced that it has licensed its OptiML(TM) Wafer-Level Camera (WLC)
technology and SHELLCASE(R) Wafer-Level Chip Scale Packaging (WLCSP)
solutions to Nemotek S.A. The combination of these consumer optics
technologies enables Nemotek to offer a full range of cost-efficient
camera solutions from wafer-level packaging of image sensors and
wafer-level lenses to fully-integrated camera modules.

Nemotek is the first company to license both the OptiML and
SHELLCASE technologies from Tessera. With these solutions, it will
provide image sensor packaging services and camera module design and
assembly for applications including mobile phones, laptop computers,
security and automotive devices.

"By leveraging the complete suite of wafer-level camera
technologies from Tessera, Nemotek is positioned to be a broad-based
supplier of camera solutions for the mobile phone market," said
Michael Bereziuk, chief operating officer, Tessera. "Morocco's close
ties to the industry's leading mobile phone vendors, as well as their
close proximity to the European business community, will enable
Nemotek to drive further adoption of Tessera's OptiML and SHELLCASE
technologies, enabling the next-generation of wafer-level consumer
optics solutions."

Nemotek is a recently established company based in Morocco and led
by Mohamed Lasry, the former chairman of STMicroelectronics-Morocco,
who was brought on as chief executive officer to help drive the
company's vision.

"This is the beginning of a long partnership with Tessera, as
their industry-leading technologies will not only enable Nemotek to be
a key player within next-generation wafer-level optic technologies,
but also supports the Moroccan strategy to become a leading region for
knowledge and innovation," said Mohamed Lasry, chief executive
officer, Nemotek. "This agreement, combined with Morocco's unique
advantages, including cost competitiveness and large, world-class
skill pool, will enable us to play a key role within the electronics
industry."

Nemotek expects to begin volume shipments of its Tessera
technology-based offerings in January 2009, with capacity plans for
more than 150 million wafer-level camera units and 250 thousand image
sensor wafers per year. For more information, go to www.nemotek.ma.

OptiML WLC technology and SHELLCASE wafer-level packaging
technology are both available for licensing from Tessera. For more
information, go to www.tessera.com.

About OptiML WLC

OptiML WLC technology provides an ideal camera solution for mobile
phone applications. The technology uses wafer-level techniques to
build thousands of lenses on a wafer at the same time, then align and
bond multiple lens wafers without the need for costly manual focusing.
Once bonded, the wafers are diced into individual optical modules
which are mounted on packaged image sensors. By using
reflow-compatible materials, the OptiML WLC technology- based modules
can be mounted directly onto the phone board using the same reflow
process used to assemble other electronics. This results in lower
labor costs, part counts and cycle times when incorporating the camera
into the phone.

About SHELLCASE

SHELLCASE WLCSP technology provides high-yield, highly-reliable
manufacturing solutions for image sensors used in next-generation
mobile devices. The technology enables very low profile camera modules
while significantly reducing assembly yield loss from contamination,
providing OEMs with greater design flexibility and an innovative tool
in the development of thinner mobile devices. The SHELLCASE RT
solution enables one the thinnest, most cost-effective form factors
for image sensor packaging with JEDEC Level 1 reliability, while the
SHELLCASE CF solution provides a high-yield, low-cost alternative to
traditional Chip on Board (CoB) packaging.

About Tessera Technologies, Inc.

Tessera is a leading provider of miniaturization technologies for
the electronics industry. Tessera provides a broad range of advanced
packaging, interconnect, and consumer optics solutions which are
widely adopted in high-growth markets including consumer, computing,
communications, medical and defense electronics. Tessera's customers
include the world's top semiconductor companies such as Intel,
Samsung, Texas Instruments, Toshiba, Micron and Infineon. The
company's stock is traded on the Nasdaq National Market under the
symbol TSRA. Tessera is headquartered in San Jose, California. For
information call 1.408.894.0700 or visit www.tessera.com.

Safe Harbor Statement

This press release contains forward-looking statements, which are
made pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve
risks and uncertainties that could cause actual results to differ
significantly from those projected. Material factors that may cause
results to differ from the statements made include delays, setbacks or
losses relating to our intellectual property or intellectual property
litigations, or any invalidation or limitation of our key patents;
fluctuations in our operating results due to the timing of new license
agreements and royalties, or due to legal costs; changes in patent
laws, regulation or enforcement, or other factors that might affect
our ability to protect our intellectual property; the risk of a
decline in demand for semiconductor products; failure by the industry
to adopt our technologies; competing technologies; the future
expiration of our patents; the future expiration of our license
agreements and the cessation of related royalty income; the failure or
refusal of licensees to pay royalties; failure to achieve the growth
prospects and synergies expected from acquisition transactions; and
delays and challenges associated with integrating acquired companies
with our existing businesses. You are cautioned not to place undue
reliance on the forward-looking statements, which speak only as of the
date of this release. Tessera's filings with the Securities and
Exchange Commission, including its Annual Report on Form 10-K for the
year ended December 31, 2006 and its Quarterly Report on Form 10-Q for
the quarter ended September 30, 2007 include more information about
factors that could affect the company's financial results.

Tessera, the Tessera logo and SHELLCASE are registered trademarks
and OptiML is a trademark of Tessera. All other company, brand and
product names may be trademarks or registered trademarks of their
respective companies.

Tessera
Julie Seymour, +1-408-836-3947
jseymour@tessera.com
or
CASANEARSHORE PR
Anouar Atmani, +212.61 499 460
a.atmani@casanearshore.com

Copyright Business Wire 2008