UPDATE-Singapore ST Engineering to sell dlr bonds - source

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HONG KONG, July 6 (Reuters) - Singapore Technologies Engineering (STEG.SI) has mandated Deutsche Bank and Morgan Stanley to make a benchmark dollar-denomnated bond issue, a source close to the deal said on Monday.

Investor presentations for the deal will be held in Singapore on July 7, in Hong Kong on July 8 and in London on July 9, with a deal likely to be follow "subject to market conditions", the source said.

Singapore Technologies Engineering, 49-percent owned by state investor Temasek Holdings [TEM.UL], has been rated AAA by Standard & Poor's.

Earlier on Monday, the engineering conglomerate said it aims to raise $1.2 billion worth of medium term notes in various currencies to fund future investments, including acquisitions and debt refinancing.

Its wholly-owned subsidiary, ST Engineering Financial I Ltd (STEF-1) will be the entity to issue the notes, which will be "unconditionally and irrevocably guaranteed by ST Engineering". (Reporting by Umesh Desai; Editing by Anshuman Daga)