New Issue-Majlis Ugama issues $29mln 5 yr Bond

SINGAPORE, Nov 12 (Reuters) - Following are terms and conditions of a bond to be issued on November 16, 2009

Borrower Majlis Ugama Islam Singapura

Form of debt Fixed Rate Bond

Issue Amount S$29 million

Coupon 2.90% pa semi-annual

Issue Date November 16, 2009

Maturity Date November 16, 2014

Coupon Payment Date 16 May and 16 November

Commencing on 16 May 2010

Denominations S$250,000

Lead Manager CIMB

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where assigned, and hit F9 on Reuters terminals.

Data supplied by International Insider.