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	    , article : {
	        storyId : "USPEK14823620080506"
	        , headline : "UPDATE 1-Samsung, Intel, TSMC to work on next-gen chip format"
	        , keywords : "[Korean Republic (south), Asia, Japan, Taiwan, Emerging countries, United States of America, Europe, Consumer electronics, Household durables, Semiconductor equipment and products, Telecommunication services (sector), Industrial conglomerates (industry), Consumer electronics, Cyclical consumer products, Cyclical consumer goods and services, Economic news, EC, business/financial pages]"
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