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Altera Corporation And TSMC Jointly Develop Heterogeneous 3D IC Test Vehicle
Altera Corporation And TSMC announced that the joint development of the heterogeneous 3D IC test vehicle using TSMC's Chip-on-Wafer-on-Substrate (CoWoS) integration process. TSMC's integrated CoWoS process provides semiconductor companies developing 3D ICs an end-to-end solution that includes the front-end manufacturing process as well as back-end assembly and test solutions.
Latest Developments for Altera Corp
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- Altera Corp Issues Q1 2013 Revenue Guidance Above Analysts' Estimates-Conference Call
- Altera Corp Raises Low End Of Prior Q4 2012 Revenue Guidance To A Range In Line With Analysts' Estimates
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