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NIDEC CORP to Issue 1st, 2nd and 3rd Unsecured Bonds


Wednesday, 7 Nov 2012 01:30am EST 

NIDEC CORP announced that it has decided to issue a JPY 65 billion unsecured 1st series bonds, each with a face value of JPY 100 million, interest rate at 0.386% per annum, and the redemption date on September 20, 2017. The subscription date is November 7, 2012 and the payment date is November 13, 2012. The Company will issue a JPY 15 billion unsecured 2nd second series bonds, each with a face value of JPY 100 million, interest rate at 0.595% per annum, and the redemption date on September 20, 2019. The subscription date is November 7, 2012 and the payment date is November 13, 2012. The Company will also issue a JPY 20 billion unsecured 3rd second series bonds, each with a face value of JPY 100 million, interest rate at 0.956% per annum, and the redemption date on September 20, 2022. The subscription date is November 7, 2012 and the payment date is November 13, 2012. Mitsubishi UFJ Morgan Stanley Securities Co., Ltd. will serve as the underwriter for the three offerings. 

Company Quote

16.3
0.03 +0.18%
12:39pm EDT