Semiconductor Manufacturing International Corp announces completion of placing of existing shares and subscription of new shares

Thursday, 12 Jun 2014 08:52am EDT 

Semiconductor Manufacturing International Corp:Completes Placing on June 09, 2014 and completion of Subscription took place on June 12, 2014.Pursuant to terms and conditions of Placing and Subscription Agreement, total of 2,590,000,000 Sale Shares were successfully placed by Joint Placing Agents to not fewer than six independent Placees.Says Placees are third parties independent of and not connected with Company and its connected persons, at placing price of HK$0.60 per Sale Share.Company allotted and issued 2,590,000,000 Subscription Shares, representing about 7.44 pct of issued share capital of Company as enlarged by issue of 2,590,000,000 new Shares, to Vendor at price of HK$0.60 per Subscription Share. 

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