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STMicroelectronics NV to Support Deployment of FD-SOI Pilot Line as Leader of Places2Be Project


Tuesday, 21 May 2013 03:00am EDT 

STMicroelectronics NV announced that Places2Be (Pilot Lines for Advanced CMOS Enhanced by SOI in 2x nodes, Built in Europe), a three-year, advanced-technology pilot-line project worth EUR 360 million, led by the Company, aims to support the deployment of a FD-SOI pilot line at 28nm and the subsequent node, as well as a dual source that will enable volume manufacturing in Europe. Places2Be will drive the creation of a European microelectronics design ecosystem using the FD-SOI platform and explore the path towards the next step for this technology (14/10nm). FD-SOI is a low-power, high-performance alternative to conventional (bulk) silicon and FinFET technologies. The first FD-SOI systems-on-chips are expected to be used in consumer electronics, high-performance computing and networking. Places2Be consists of 19 partners from seven countries. 

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