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STMicroelectronics NV Reveals New Micro-package Components

Tuesday, 24 Sep 2013 09:00am EDT 

STMicroelectronics NV announced that it is revealing new families of integrated micro-package components used by OEMs to build small and featured products. The latest devices joining the Company's micro-package families include: single-line Transient-Voltage Suppressor, the ESDAVLC6-1BV2, in a 01005 surface-mount package to protect sensitive circuitry against hazardous voltage surges, five members of the Company's new ECMF family of common-mode filters embedding ESD protection built using advanced silicon technology and offered in ultra-thin packages of 0.55 millimeter high and BAL-NRF01D3 ultra-miniature wireless balun.