Profile: ON Semiconductor Corp (ONNN.O)
18 Jun 2013
ON Semiconductor Corporation (ON Semiconductor), incorporated on June 22, 2000, designs, manufactures and markets a portfolio of semiconductor components that address the design needs of electronic systems and products. The Company operates in three segments: Application Products Group, Standard Products Group, and SANYO Semiconductor Products Group. The Company's power management semiconductor components control, convert, protect and monitor the supply of power to the different elements within a variety of electronic devices. The Company’s portfolio of power and signal management, logic, discrete and custom devices focuses customers in automotive, communications, computing, consumer, industrial, light emitting diode (LED) lighting, medical, military/aerospace, smart grid and power applications. The Company's data management semiconductor components provide clock management and data flow management for precision computing and communications systems.
The Company serves a range of end-user markets, including automotive, communications, computing, consumer, medical, industrial, smart grid and military/aerospace. Applications for the Company's products in these markets include portable electronics, computers, game consoles, servers, automotive and industrial control systems, LED lighting, power supplies, networking and telecom gear and automated test equipment. Its standard semiconductor components serve as building block components within virtually types of electronic devices. The Company's portfolio of devices enables the Company to offer integrated circuits (ICs) and the building block components that deliver system level functionality and design solutions. During the year ended December 31, 2012, the Company's product portfolio consisted of approximately 44,000 products and the Company shipped approximately 37.1 billion units in 2012. The Company is engaged in micro packages.
As of December 31, 2012, the Company has approximately 450 direct customers worldwide. The Company also service approximately 530 original equipment manufacturers (OEMs) indirectly through its distributor and electronic manufacturing service provider customers. The Company's direct and indirect customers include: (OEMs in a range of industries, such as Continental Automotive Systems, Samsung Electric, Panasonic, Delta, and Hella; (electronic manufacturing service providers, such as Flextronics, Jabil, Sanmina, Benchmark Electronic and HK Towada Electronics, and global distributors, such as Avnet, World Peace, OS Electronics, Arrow and WT Microelectronics. As of December 31, 2012, the Company had domestic design operations in Arizona, California, Colorado, Idaho, Montana, Oregon, Pennsylvania, Rhode Island, Texas and Utah. In addition, as of December 31, 2012, the Company operated domestic manufacturing facilities in California, Idaho and Oregon and have foreign manufacturing facilities in Belgium, Canada, China, Czech Republic, Japan, Malaysia, Philippines, Thailand and Vietnam.
The Company operates front-end wafer site facilities located in Belgium, Canada, Czech Republic, Japan, Malaysia, and the United States, and back-end assembly and test site facilities located in Canada, China, Japan, Malaysia, Philippines, Thailand, and Vietnam. In addition to these front-end and back-end manufacturing operations, the Company's facility in Roznov, Czech Republic manufactures silicon wafers that are used by a number of its facilities. The Company operates all of its manufacturing facilities directly, except in the case of its joint venture in Leshan, China. The Company operates an assembly and test operations facility in Leshan, China. This facility is owned by a joint venture company, Leshan-Phoenix Semiconductor Company Limited (Leshan), of which the Company owns a majority of the interests. As part of the Company's manufacturing agreements with Leshan, the Company supply dies used in the production process. The Company uses third-party contractors for some of its manufacturing activities, primarily for wafer fabrication and the assembly and testing of finished goods.
Application Products Group
The Application Products Group designs and develops analog, mixed-signal and advanced logic application specific integrated circuits (ASIC) and application specific standard products (ASSP) solutions for the automotive, medical, military/aerospace, computing, wireless communications, consumer and industrial markets. The Application Products Group's automotive products are focused on energy efficient solutions. The Company's ASIC and ASSP portfolio includes semiconductor solutions for medical devices, such as defibrillators, pacemakers, neurostimulators, hearing aids, glucose meters and patient monitors. It also includes mixed-signal offerings for industrial, medical imaging, smart grid and building automation, as well as clock and timing management products for industrial, communications, and consumer applications.
The Company serves the portable audio and wireless smartphone markets with digital signal processing (DSP) technology and tunable capacitor products that originated from ASIC and ASSP product development for medical applications. The Company is a supplier of two dimensional (2D) and complementary metal oxide semiconductor (CMOS) images sensors for machine vision, space, and cinematography applications. The Company's military/aerospace products include standard-cell ASIC technologies down to 40 nanometer, using both internal and external foundries. The Company develops power conversion products (Alternating Current (AC) Direct Current (DC) and DC-DC) and power interfaces products. The Company offers solutions for a range of voltage and current options from multi-phase 30 volt power for VCORE processors to single cell battery point of load, battery charging, thermal monitoring and management, system monitoring and the connectivity and protection around them.
The Company competes with STMicroelectronics N.V., Texas Instruments Incorporated, Elmos Semiconductor and ZMD AG, Cypress Semiconductor, Integrated Device Technology, Inc., Xilinx, Inc., Altera Corporation, Open-Silicon, Inc., e-Silicon Corporation, X-FAB Semiconductor Foundries AG, Taiwan Semiconductor Manufacturing Company, Ltd., Tower Semiconductor Ltd., MagnaChip Semiconductor LLC, Microchip Technology, Inc., Maxim Integrated Products, Inc., Analog Devices, Inc., Linear Technology Corporation, Intersil Corporation, Maxim Integrated Products, Inc., Texas Instruments Incorporated, STMicroelectronics N.V. and Power Integrations, Inc.
Standard Products Group
The Standard Products Group serves a range of end-user markets, including consumer electronics, computing, wireless and wired communications, automotive electronics, industrial electronics and medical via six major discrete semiconductor technology categories: diodes and transistors, analog products, LED drivers, electrically erasable programmable read-only memory (EEPROMs), power metal oxide semiconductor field effect transistor (MOSFETs) and Standard Logic. The range of discrete and integrated semiconductor products that the Company offers within these categories perform multiple application functions, including power switching, signal conditioning, circuit protection, signal amplification and voltage reference functions.
The Company competes with Diodes Incorporated, NXP B.V., Rohm Co., Ltd., TSPS Corporation, Infineon Technologies AG, Vishay Intertechnology, Inc., Fairchild Semiconductor International, Inc., STMicroelectronics N.V. and Semtech Corporation.
SANYO Semiconductor Products Group
The Company's SANYO Semiconductor Products Group is a global supplier of analog and mixed signal ICs, microcontrollers, DSPs, analog and digital tuners, intelligent power modules, memory and discrete semiconductors to the automotive, communications, consumer and industrial end-markets. The Company's diverse product portfolio includes analog power management ICs; motor drive ICs; intelligent modules for power inversion, motor control, and automotive electronics; eight bit and 16 bit microcontrollers; audio and video tuners; DSPs and image enhancement products supporting a range of applications, including automotive infotainment and motor control systems, consumer white goods, wireless communications devices (including smartphones and media tablets), liquid crystal display (LCD) televisions, and digital still cameras and camcorders. The Company possesses micro-packaging capabilities. For home appliance and industrial power applications, the Company possesses power assembly packaging and composite material IP.
The Company competes with Toshiba Corporation, Renasas Electronics Corporation, NXP B.V., Rohm Co. Ltd., Mitsubishi Electric, Sanken Electric, STMicroelectronics N.V., Fairchild Semiconductor International, Inc., International Rectifier Corporation and Texas Instruments Incorporated.
ON Semiconductor Corp
5005 East McDowell Road
PHOENIX AZ 85008