Profile: AEHR Test Systems (AEHR.O)
14 Mar 2014
Aehr Test Systems, incorporated on May 25, 1977, develops, manufactures and sells systems, which is designed to reduce the cost of testing and to perform reliability screening, or burn-in, of complex logic and memory devices. These systems can be used to perform parallel testing and burn-in of packaged integrated circuits (ICs), singulated bare die or ICs still in wafer form. It manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures, die carriers and related accessories. The Company has developed and introduced several product families, including the ABTSTM and FOXTM systems, the WaferPak cartridge and the DiePak carrier. The new ABTS family of systems can perform test during burn-in of complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip, and offers Individual Temperature Control for high-power advanced logic devices. The WaferPak cartridge includes a full-wafer probe card for use in testing wafers in FOX systems.
Full Wafer Contact Systems
The FOX-1 full wafer parallel test system is designed for massively parallel test in wafer sort. The FOX-1 system is designed to make electrical contact to and test all of the die on a wafer in a single touchdown. The FOX-1 test head and WaferPak contactor are compatible with industry-standard 300 millimeter wafer probers, which provide the wafer handling and alignment automation for the FOX-1 system. The FOX-1 pattern generator is designed to functionally test industry-standard memory, such as flash and DRAMs. The FOX-1 pin electronics and per-device power supplies are tailored to full-wafer functional test. The FOX-15 is focused on parallel testing and burning-in up to 15 wafers at a time.
Systems for Packaged Parts
Test during burn-in (TDBI), systems consist of several subsystems: pattern generation and test electronics, control software, network interface and environmental chamber. The test pattern generator allows duplication of most of the functional tests performed by a traditional tester. Pin electronics at each burn-in board (BIB), position are designed to provide signals to the ICs being tested and detect whether a device is failing the test. The ABTS system can test and burn-in both high-power logic and low-power ICs. It can be configured to provide individual device temperature control for devices up to 50 watts or more and with up to 320 I/O channels. The MAX3 system is designed for monitored burn-in of memory and logic devices. It has 96 channels and holds 64 burn-in boards, each of which may hold up to 350 or more devices, resulting in a system capacity of up to 22,400 or more devices.
The Company sells, and licenses others to manufacture and sell, custom-designed test fixtures for its systems. The test fixtures include BIBs for the ABTS parallel test and burn-in system and for the MAX monitored burn-in system. These test fixtures hold the devices undergoing test or burn-in and electrically connect the devices under test to the system electronics. The Company's DiePak product line includes a family of reusable, temporary die carriers and associated sockets that enable the test and burn-in of bare die using the same test and burn-in systems used for packaged ICs. DiePak carriers offer cost-effective solutions for providing KGD for most types of ICs, including memory, microcontroller and microprocessor devices.
The Company competes with Advantest Corporation, Teradyne Inc., Micronics Japan Co., Ltd., Matsushita Electric Industrial Co., Ltd., Delta V Instruments, Incorporated, Dong-Il Corporation, Micro Control Company, Incal Technology, UniTest Inc., Blue Engineering Inc., Yamaichi Electronics Co., Ltd. and FormFactor, Inc.
AEHR Test Systems
400 KATO TERRACE
FREMONT CA 94539