Profile: Aixtron SE (AIXG.O)
27 Jun 2016
AIXTRON SE (AIXTRON), incorporated on December 22, 2010, is a provider of deposition equipment to the semiconductor industry. The Company's technology solutions are used by a range of customers across the world to build components for electronic and opto-electronic applications based on compound, silicon or organic semiconductor materials. Such components are used in fiber optic communication systems, wireless and mobile telephony applications, optical and electronic storage devices, computing, signaling and lighting, displays, as well as a range of other technologies.
The Company's business activities include developing, producing and installing equipment for the deposition of semiconductor and other complex materials, process engineering, consulting and training, including ongoing customer support and after-sales service. The Company supplies its customers with both production-scale material deposition systems and small scale systems for research and development (R&D) or small scale production.
The Company's product range includes customer specific systems capable of depositing material films on a range of different substrate sizes and materials. The deposition technologies for opto and power electronics include metal-organic chemical vapor deposition (MOCVD) for the deposition of compound materials to produce light emitting diodes (LEDs), power electronics or other optoelectronic components.
For thin film deposition technologies for organic electronics applications, including OLEDs, the Company offers polymer vapor phase deposition (PVPD) and organic vapor phase deposition (OVPD). For thin film encapsulation, the Company offers a plasma enhanced chemical vapor phase deposition (PECVD) technology. PECVD is also being employed for the deposition of carbon nanostructures (carbon nanotubes, nanowires or graphene). For logic and memory applications, the Company's systems are capable of depositing material films on wafers of approximately 300 millimeter (mm) in diameter for the production of memory chips, by employing technologies, such as chemical vapor deposition (CVD) and atomic layer deposition (ALD).
The Company's portfolio of products include Planetary Reactor, AIX G5+C, AIX G5 WW, AIX 2800G4-TM, Close Coupled Showerhead, AIX R6, Nano CVD Reactors BM Series, QXP-8300 ALD Metal, QXP-8300 ALD Oxide and CRIUS R MOCVD. Its potential applications/devices include LEDs, Optoelectronics, Laser devices for consumer electronics, High-Frequency devices for wireless datacom, silicon carbide (SiC) based High Power Devices, gallium nitride (GaN) based power devices, Solar cells, organic light-emitting diode (OLED) for displays, OLEDs for solid state lighting, organic transparent thin film solar cells, electronic semiconductor structures for flexible displays, functional polymer layers, dielectric or passivating polymer layers and graphene structures for electronic applications. The Company also offers a range of peripheral equipment and services.
The Company competes with Veeco Instruments Inc., Taiyo Nippon Sanso, Jusung Engineering Co. Ltd., Nuflare Technology Inc., Advanced Micro-Fabrication Equipment Inc., Tang Optoelectronics Equipment (Shanghai) Corporation Limited, LAM Research, Inc. (USA), Applied Materials, Inc. (USA), Tokyo Electron Ltd. (Japan), ASM International N.V. (Netherlands), IPS Technology (South Korea), Hitachi Kokusai Electric Co. Inc. (Japan), Ulvac, Inc. (Japan), Tokki Corporation (Japan), SNU Precision (South Korea) and Sunic System (South Korea).