Profile: Cypress Semiconductor Corp (CY.O)
26 Sep 2016
Cypress Semiconductor Corporation, incorporated on September 26, 1986, delivers solutions from automotive, industrial and networking platforms to interactive consumer and mobile devices. The Company operates through four segments: Programmable Systems Division, Memory Products Division, Data Communications Division and Emerging Technologies Division. The Company's product portfolio includes NOR flash memories, Static random access memory (SRAM) and ferroelectric-RAMs (F-RAM), Traveo microcontrollers, the industry's programmable system-on-chip (PSoC) solutions, analog and Power Management integrated circuits (PMICs), CapSense capacitive touch-sensing controllers, and Wireless Bluetooth Low-Energy (BLE) and universal serial bus (USB) connectivity solutions. It serves various markets, including automotive, industrial, communications, consumer, computation, data communications, mobile handsets and military.
Programmable Solutions Division/Programmable Systems Division
The Company's Programmable Solutions Division designs and develops solutions for end-product manufacturers. The programmable portfolio includes Traveo automotive microcontrollers, PSoC products, ARM Cortex-M4, -M3, -M0+ microcontrollers and R4 CPUs, analog PMIC, CapSense capacitive-sensing controllers, TrueTouch touchscreen and fingerprint reader products, and PSoC Bluetooth Low Energy solutions for the Internet of Things (IoT). Traveo MCUs and Flexible Microcontrollers are used for automotive body electronics, battery management, driver information systems, factory automation and other applications. PSoC 1, PSoC 3, PSoC 4 and PSoC 5LP include IoT applications, and industrial and automotive control applications. CapSense are used for consumer products and other applications. TrueTouch are used for automotive infotainment systems and factory automation. Analog PMICs, light-emitting diode (LED) drivers and energy harvesting solutions include body control modules and instrument cluster systems. CapSense devices feature SmartSense technology, an automatic tuning solution that detects and adjusts a system's capacitive-sensing parameters, eliminating the need for manual tuning. The CapSense MBR3 mechanical button replacement solution enables designers to implement user interfaces for a range of markets. MBR3 devices offer noise immunity, proximity sensing and water tolerance. Its lineup of power management integrated circuits (PMICs) includes direct current-to-direct current (DC/DC) converters, voltage regulators and supervisors, and power monitoring and reset ICs. In addition, it offers a family of LED lighting driver integrated circuits (ICs) and energy harvesting solutions.
Memory Products Division
The Company's Memory Products Division designs and manufactures portfolio of high-performance memories for embedded systems. It also includes technology products and specialty memory offerings. Its products include NOR Flash and HyperFlash, NAND Flash, HyperRAM, asynchronous SRAMs, synchronous SRAMs, nvSRAMs, F-RAMs, dual-port memories, first-in, first-out (FIFO) memories, programmable clocks and RoboClock buffers. NOR Flash and HyperFlash are used in automotive advanced driver assistance systems (ADAS), automotive instrument cluster, networking routers and switches, and other applications. NAND Flash are used in set-top boxes, point-of-sale systems and security systems. HyperRAM are used for digital cameras, projectors, factory automation, medical equipment, and home automation and appliances. Asynchronous SRAMs are used for consumer electronics, switches and routers, test equipment, automotive and industrial electronics. Synchronous SRAMs are used for enterprise routers and switches, wireless base stations, high bandwidth applications and industrial and defense electronics. nvSRAMs are used for redundant array of independent disks (RAID) servers, point of sale terminals, set-top boxes, industrial automation, single-board computers and gaming. F-RAMs are used in aerospace and medical systems, and also applications, including automotive, smart electric meters, industrial controls, electronic point-of-sale terminals, printers and wireless (radio-frequency identification) memory. FIFO memories are used in various markets, including video, data communications, telecommunications and network switching/routing. Programmable clocks are used for copiers and printers. RoboClock buffers offer solutions for designers of communications, computation and storage networking applications.
Data Communications Division
The Company's Data Communications Division focuses on USB controllers, BLE solutions that leverage Cypress's PRoC technology, WirelessUSB solutions, module solutions, such as trackpads and BLE modules, and controllers for the USB Type-C standard, which enables data transmission and power delivery over a single cable with a slimmer plug. Data Communications Division focuses primarily on industrial, handset and consumer electronics markets and applications. USB controllers are used in printers, cameras, machine vision and other industrial equipment, mice, keyboards, handheld devices, gamepads and joysticks, voice over Internet protocol (VoIP) phones, headsets, presenter tools, dongles, point of sale devices and bar code scanners. EZ-PD controllers for USB-C with Power Delivery are used for USB-C power adapters, USB-C adapter cables, monitors, docking stations and other applications. BLE and WirelessUSB solutions are used for mice, keyboards, wireless headsets, consumer electronics, gamepads, remote controls, toys and presenter tools. Trackpad solutions are used in laptop computers and consumer devices.
Emerging Technologies Division
The Company's Emerging Technologies Division consists of the Company's subsidiaries, AgigA Tech, Inc. and Deca Technologies, Inc. It also includes the Company's foundry services, other development-stage activities and corporate expenses. AgigA Tech, Inc. is engaged in the development of battery-free non-volatile memory solutions. Its product is AGIGARAM. Deca Technologies, Inc. is engaged in wafer-level chip scale packaging (WLCSP) solutions serving semiconductor producers.
The Company competes with Intel, Analog Devices, Atmel, NXP Semiconductors NV, GSI Technology, Integrated Device Technology, Integrated Silicon Solution, Lattice Semiconductor, Linear Technology, Maxim Integrated Products, Microchip Technology, Renesas, Silicon Laboratories, ST Microelectronics, Synaptics, Texas Instruments and Xilinx.
Cypress Semiconductor Corp
198 Champion Court
SAN JOSE CA 95134
Company Web Links
- BRIEF-Cypress names Hassane El-Khoury as next CEO
- BRIEF-Cypress says ownership in Deca reduced to 52.5 pct
- BRIEF-Cypress Q2 loss per share $1.65
- BRIEF-Cypress Semiconductor entered into a joinder and amendment agreement
- BRIEF-Cypress Semiconductor closes acquisition of wireless Internet of Things business and related assets of Broadcom Ltd