Profile: Kulicke and Soffa Industries Inc (KLIC.OQ)
Kulicke and Soffa Industries, Inc. (K&S), incorporated on November 26, 1956, designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits (IC), high and low powered discrete devices, light-emitting diodes (LEDs), and power modules. The Company also service, maintain, repair and upgrade its equipment. The Company's customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers (OSATs), other electronics manufacturers and automotive electronics suppliers. The Company operates two segments: Equipment and Expendable Tools.
The Company manufactures and sells a line of balls bonders, heavy wire wedge bonders, wafer level bonders, and die bonders that are sold to semiconductor device manufacturers, OSATs, other electronics manufacturers and automotive electronics suppliers. Ball bonders are used to connect wires, typically made of gold or copper, between the bond pads of the semiconductor device, or die, and the leads on its package. Wedge bonders use either aluminum wire or ribbon to perform the same function in packages that cannot use gold or copper wire because of either high electrical current requirements or other package reliability issues. Wafer level bonders mechanically apply bumps to die, typically while still in the wafer format, for some variants of the flip chip assembly process. Die bonders are used to attach a die to the substrate or lead frame which will house the semiconductor device.
Automatic ball bonders represent the portion of the Company's semiconductor equipment business. The Company designs and manufactures heavy wire wedges bonders for the power semiconductor and automotive power module markets. The Company also sells manual wire bonders, and the Company offers spare parts, equipment repair, training services, and upgrades for its equipment through its Support Services business unit.
The Company competes with ASM Pacific Technology, Shinkawa, Cho-Onpa, F&K Delvotec, Hesse & Knipps, BE Semiconductor Industries N.V., Canon and Hitachi.
Expendable Tools Segment
The Company manufactures and sells a variety of expendable tools for ranges of semiconductor packaging applications. The Company's principal Expendable Tools segment products include Capillaries, Bonding wedges and Dicing blades. Capillaries are expendable tools used in ball bonders. Made of ceramic and other elements, a capillary guides the wire during the ball bonding process. Its features help control the bonding process. Bonding wedges are expendable tools used in wedge bonders. Like capillaries, their specific features are tailored to specific applications. Dicing blades are expendable tools used by semiconductor manufacturers to cut silicon wafers into individual semiconductor die and to cut semiconductor devices that have been molded in a matrix configuration into individual units.
The Company competes with PECO, Small Precision Tools, Inc., Disco Corporation and Coorstek.
Kulicke and Soffa Industries Inc
#01-01, 23A SERANGOON NORTH AVEN
FORT WASHINGTON PA 554369