Profile: Meltronix Inc (MTNX.PK)
26 Aug 2015
MeltroniX, Inc. (founded in 1984) and its wholly owned subsidiaries (MeltroniX Solutions, Inc., Microelectronic Packaging of America, Inc., and MPI Place Holder, Inc.) are providers of Advanced Electronic Manufacturing Services, Products, Design, and Testing to high growth industries and applications including: Internet equipment; wireless/telecommunication; medical; satellites and military systems; and broadband communication and other electronic systems manufacturers. This is based on MeltroniX's ability to develop and manufacture high-density packaging and interconnect microelectronic products. Currently, MeltroniX is placing renewed emphasis on military and space applications by leveraging its capabilities in offering devices which are radiation tolerant and qualified to military specifications.
Some of MeltroniX's standard products will utilize United States Semiconductor Corporation's (USSC) proprietary, patented process called RHI-NO (Radiation Hardened Integrated circuit-NO redesign), which is based on two exclusive licenses from Lawrence Livermore National Laboratory. The process instills dramatic improvements in chip tolerance of radiation effects, independent of the fabrication process. It enables satellite and military system designers to use commercial parts that may not have been available in the past because of radiation performance problems. RHI-NO is not expected to generate any revenue in 2002.
This confluence of capabilities between MeltroniX and USSC's need for a manufacturing and marketing organization to commercialize RHI-NO has resulted in a true synergy. In February of 2001, USSC and MeltroniX signed a Letter of Intent (LOI) for USSC to purchase 50% of the stock of MeltroniX. Included in this deal is the granting of a sub-license for RHI-NO technology. This process is underway as USSC continues to raise funds from private investors to complete the transaction. On September 27, 2001, the MeltroniX Board announced a new focus on space and military business.
MeltroniX's key technologies include: chip and wire hybrids; chip-on-board and SMT assembly; FLIP Chip; BGA high-density packaging; thick-film or thin film substrates; organic laminate substrates; plated-up copper and beryllia substrates; hermetic Kovar and ceramic packages; and wafer bumping.
The Company's line of Advanced IC Packaging Products includes multilayer ceramic packages and substrates, including pin grid arrays (PGA's), leaded chip carriers, ceramic quad flat packs and ceramic substrates along with FLIP Chip, Surface Mount and BGA modules.
The Company's Multichip Modules (MCM's) include multiple ICs (either die or packaged) mounted directly onto a high density substrate, provide higher performance, lower power consumption, less size and weight, and lower cost.
MeltroniX intends to offer a number of advanced electronic functions in hermetic ceramic packages that are built and tested to the stringent requirements of space projects, including survivability to the natural radiation affects in space. Included in this family of components are RHI-NO processed commercial ICs available in monolithic or MCM configurations.
MeltroniX seeks to obtain licenses to technologies that complement and expand the current technologies that MeltroniX owns. In February 2001, MeltroniX executed a letter of intent with United States Semiconductor Corporation (USSC) for a transaction, which, when consummated, will provide that USSC will grant MeltroniX an exclusive, non transferable license for the use of USSC's technology in exchange for a percentage to be determined of MeltroniX's common stock; and purchase a percentage yet to be determined of the common stock of MeltroniX. The expenses to further develop the technology to a commercially feasible and manufacturable level are to be borne by USSC. Once established, MeltroniX is to manufacture the developed products and, upon sale, will be obligated to pay USSC a royalty, the amount of which has yet to be agreed upon.
The Company's competitors include the global multinational companies of Aeroflex, Flextronics, SCI, Sanmina, and others as well as regional and more specialized companies such as HEI, Maxtek, VLSI Packaging, and Natel Engineering. There are also "off shore" competitors such as AMKOR in Korea and Tong Tshing in Taiwan that tend to focus more on industry standard, very high volume packages used by the semiconductor companies.
9577 Chesapeake Dr
SAN DIEGO CA 92123-1304