Profile: Maxim Integrated Products Inc (MXIM.OQ)

MXIM.OQ on NASDAQ Stock Exchange Global Select Market

30.96USD
19 Sep 2014
Price Change (% chg)

$-0.46 (-1.46%)
Prev Close
$31.42
Open
$31.50
Day's High
$31.50
Day's Low
$30.92
Volume
1,274,505
Avg. Vol
741,106
52-wk High
$35.76
52-wk Low
$27.40

Search Stocks

Maxim Integrated Products, Inc. (Maxim), incorporated on August 19, 1987, designs, develops, manufactures and markets a range of linear and mixed-signal integrated circuits, commonly referred to as analog circuits, for a number of customers in diverse geographical locations. The end-markets in which the Company sells its products are the industrial, communications, consumer and computing markets. The Company utilizes its own wafer fabrication facilities as well as third party foundries for the production of its wafers. The majority of processed wafers are subject to parametric and functional testing at its facilities. In addition, hybrid and module products are manufactured using a complex multi-chip technology featuring thin-film, laser-trimmed resistors and other active or passive components. In January 2013, the Company announced that GEO Semiconductor Inc acquired the digital video processing business from Maxim Integrated Products Inc. In October 2013, the Company acquired Volterra Semiconductor Corporation.

Once wafer manufacturing has been completed, wafers may be sorted in order to determine which integrated circuits on each wafer are functional and which are defective. The Company performs the majority of wafer sorting, final testing and shipping activities at two facilities located in Cavite, the Philippines and Chonburi Province, Thailand, although it also utilize independent subcontractors for some wafer sorting. The Company has a wafer bump manufacturing facility located in Dallas, Texas. It uses this facility to manufacture products that utilize chip scale packaging (CSP) or wafer level packaging (WLP). CSP or WLP (collectively referred to as CSP) enables integrated circuits to be attached directly to a printed circuit board without the use of a traditional plastic package. Integrated circuit assembly is performed by foreign assembly subcontractors, located in China, Japan, Malaysia, the Philippines, Taiwan, Thailand, Singapore and South Korea, where wafers are separated into individual integrated circuits and assembled into a variety of packages.

The Company competes with Analog Devices, Inc., Intersil Corporation, Linear Technology Corporation, NXP Semiconductors NV, Semtech Corporation and Texas Instruments Inc.

Company Address

Maxim Integrated Products Inc

160 RIO ROBLES
SAN JOSE   CA   95134-1813
P: +1408.6011000

Search Stocks