Profile: ON Semiconductor Corp (ONNN.OQ)

ONNN.OQ on NASDAQ Stock Exchange Global Select Market

12.75USD
27 Feb 2015
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$-0.11 (-0.86%)
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ON Semiconductor Corporation (ON Semiconductor), incorporated on June 22, 2000, designs, manufactures and markets a portfolio of semiconductor components that address the design needs of electronic systems and products. The Company operates in three segments: Application Products Group, Standard Products Group, and System Solutions Group. The Company's power management semiconductor components control, convert, protect and monitor the supply of power to the different elements within a variety of electronic devices. The Company’s portfolio of power and signal management, logic, discrete and custom devices focuses customers in automotive, communications, computing, consumer, industrial, light emitting diode (LED) lighting, medical, military/aerospace, smart grid and power applications. The Company's data management semiconductor components provide clock management and data flow management for precision computing and communications systems. In August 2014, the Company acquired Aptina Imaging.

The Company serves a range of end-user markets, including automotive, communications, computing, consumer, medical, industrial, smart grid and military/aerospace. Applications for the Company's products in these markets include portable electronics, computers, game consoles, servers, automotive and industrial control systems, LED lighting, power supplies, networking and telecom gear and automated test equipment. Its standard semiconductor components serve as building block components within virtually types of electronic devices. The Company's portfolio of devices enables the Company to offer integrated circuits (ICs) and the building block components that deliver system level functionality and design solutions. During the year ended December 31, 2013, the Company's product portfolio consisted of approximately 46,000 products and the Company shipped approximately 42.4 billion units in 2013. The Company is engaged in micro packages.

The Company's direct and indirect customers include: (OEMs in a range of industries, such as Continental Automotive Systems, Samsung Electric, Panasonic, Delta, and Hella; (electronic manufacturing service providers, such as Flextronics, Jabil, Sanmina, Benchmark Electronic and HK Towada Electronics, and global distributors, such as Avnet, World Peace, OS Electronics, Arrow and WT Microelectronics. As of December 31, 2013, the Company had domestic design operations in Arizona, California, Colorado, Idaho, Montana, Oregon, Pennsylvania, Rhode Island, Texas and Utah. In addition, as of December 31, 2013, the Company operated domestic manufacturing facilities in California, Idaho and Oregon and have foreign manufacturing facilities in Belgium, Canada, China, Czech Republic, Japan, Malaysia, Philippines, Thailand and Vietnam.

The Company operates front-end wafer site facilities located in Belgium, Canada, Czech Republic, Japan, Malaysia, and the United States, and back-end assembly and test site facilities located in Canada, China, Japan, Malaysia, Philippines, Thailand, and Vietnam. In addition to these front-end and back-end manufacturing operations, the Company's facility in Roznov, Czech Republic manufactures silicon wafers that are used by a number of its facilities. The Company operates all of its manufacturing facilities directly, except in the case of its joint venture in Leshan, China. The Company operates an assembly and test operations facility in Leshan, China. This facility is owned by a joint venture company, Leshan-Phoenix Semiconductor Company Limited (Leshan), of which the Company owns a majority of the interests. As part of the Company's manufacturing agreements with Leshan, the Company supply dies used in the production process. The Company uses third-party contractors for some of its manufacturing activities, primarily for wafer fabrication and the assembly and testing of finished goods.

Application Products Group

The Application Products Group designs and develops analog, mixed-signal and advanced logic ASIC and ASSP solutions for a broad base of end-users in the automotive, consumer electronics, computing, industrial, communications, medical and military / aerospace markets. Its product solutions enable industry leading active mode and standby mode efficiency now being demanded by regulatory agencies around the world. Additionally, the Application Products Group offers foundry and manufacturing services, including IPD technology, which leverages the Company’s broad range of manufacturing, IC design, packaging and silicon technology offerings to provide flexible turn-key solutions for its customers.

The Company competes with Elmos Semiconductor AG; Intersil Corporation; Maxim Integrated Products, Inc.; Melexis N.V.; STMicroelectronics N.V.; and Texas Instruments Inc.

Standard Products Group

The Standard Products Group offers protection and filtering products, technical performance, micro-packaging, high quality, low cost structure, and supply chain management which ensures supply to key customers.

The Company competes with Diodes Incorporated; Fairchild Semiconductor International, Inc.; Infineon Technologies AG; KEC Corporation; NXP B.V.; Rohm Co., Ltd.; Semtech Corporation; STMicroelectronics N.V.; and Vishay Intertechnology, Inc.

System Solutions Group

The Company's System Solutions Group is a global supplier of analog and mixed signal ICs, microcontrollers, DSPs, analog and digital tuners, intelligent power modules, memory and discrete semiconductors to the automotive, communications, consumer and industrial end-markets.

The Company competes with Fairchild Semiconductor International, Inc.; International Rectifier Corporation; Mitsubishi Electric; NXP B.V.; Renasas Electronics Corporation; Rohm Co. Ltd.; Sanken Electric; STMicroelectronics N.V.; Texas Instruments Incorporated; and Toshiba Corporation.

Company Address

ON Semiconductor Corp

5005 East McDowell Road
PHOENIX   AZ   85008
P: +1602.2446600

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