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Profile: Orbotech Ltd (ORBK.F)

ORBK.F on Frankfurt Stock Exchange

29.93EUR
21 Feb 2017
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Orbotech Ltd. (Orbotech), incorporated on February 8, 1981, is a supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. The Company operates through three segments: Production Solutions for the Electronics Industry, Solar Energy and Recognition Software. The Company designs, develops, manufactures, markets and services solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs) and semiconductor devices (SDs). The Company's products include direct imaging (DI), automated optical inspection (AOI), automated optical repair (AOR) and other production systems used in the manufacture of PCBs; AOI, test, repair and process monitoring systems used in the manufacture of FPDs, and etch, physical vapor deposition (PVD) and chemical vapor deposition (CVD) equipment for use in the manufacture of SDs, such as micro-electro-mechanical systems (MEMS), advanced semiconductor packaging (Advanced Packaging), power and radio frequency (RF) devices and high brightness light emitting diode (HBLED) devices.

The Company markets computer-aided manufacturing (CAM) and engineering solutions for PCB production, which are designed and developed by Frontline P.C.B. Solutions Limited Partnership (Frontline). In addition, through its subsidiary Orbotech LT Solar, LLC (OLTS), the Company is engaged in the research, development and marketing of products for the deposition of thin film coating of various materials on crystalline silicon photovoltaic wafers for solar energy panels through plasma-enhanced chemical vapor deposition (PECVD), and, through its subsidiary Orbograph Ltd. (Orbograph), the Company is engaged in the development and marketing of character recognition solutions to banks, financial and other payment processing institutions. It has an installed base of approximately 12,800 PCB systems. Its FPD customers include the display manufacturers and have an installed base of approximately 1,700 FPD systems. Its SD customers include SD manufacturers, foundries and outsourced semiconductor assembly and test (OSAT) providers, and have an installed base of approximately 2,300 SD systems.

The Company's PCB-AOI systems are computerized, electro-optical systems for inspection and identification of defects in the artwork design master, production photo tools and PCBs at various stages of production. Its PCB-AOI systems are designed for integration into the production processes of PCB manufacturing facilities. Its PCB-AOI offering includes the Fusion series and the Discovery II series of AOI systems. The Fusion can handle resolutions of approximately five microns (Ultra Fusion 600 model) and provides detection on semi transparent and multi-colored substrates. The Company's offering of verification and repair stations consist of the VeriSmart, VeriWide, VeriFine and Ultra VeriFine-A.

The Company's CAM and engineering solutions are designed for use in the PCB pre-production phase to facilitate automation and integration of the sales, tooling, production data and inspection needs associated with PCB production. The Frontline products include CAM and engineering software solutions. Its CAM and engineering product lines include InCAM, Genesis 2000, GenFlex, InPlan, InPlanFlex, InStack, InSolver and InSight PCB. The adapted versions of the Company's AOI, AOR, imaging, inkjet, laser drilling and CAM solutions are offered for use by manufacturers of other electronic components, including manufacturers of touch screen modules, ceramics, packaging and chemical milling.

The Company's FPD-AOI and test systems manufactured and marketed by the Company identify and classify defects, and the repair systems manufactured and marketed by the Company are designed to enable customers to repair defects. It offers a range of online and offline FPD-AOI systems that includes the Quantum Series. In addition, it offers features to its FPD-AOI systems that include Multi Modality Classification (MMC), Mobile and Large Displays Peripheral Inspection (MDPI/LDPI), Variable Pattern Inspection (VPI), Advanced Video Classification (AVC), in-scan classification (ISC), Digital Macro (DM) inspection and Critical Dimension and Overlay Measurement (CDO). Peripheral Inspection provides inspection coverage of the non-repetitive pattern of the peripheral area of the panel. VPI enables the inspection of active area pixel patterns that occur in multiple pitches, such as those used in in-cell touch and hybrid touch displays. AVC and ISC both employ scan and microscopic review to enable the automatic classification of defects identified by its FPD-AOI systems during the scanning process.

The Company's ArrayChecker test systems detect, locate, quantify and characterize electrical, contamination and other defects in active matrix liquid crystal display (LCD) and organic LED (OLED) after array fabrication. Its EYES-2020 offers a process monitoring system providing defect data analysis. Its SD products include etch and deposition equipment designed to facilitate the packaging of semiconductors and to provide wafer processing technologies for the micro-electronics industry. Its end market applications include Advanced Packaging, MEMS, LEDs, radio frequency device integrated circuits (ICs) and power semiconductors. It operates in various segments of Advanced Packaging: bumping; three-dimensional (3D) wafer level packaging; 2.5 and 3D, and Fan-Out Wafer Level Packaging (FOWLP)/embedded chips.

Production Solutions for the Electronics Industry

The Company's Production Solutions for the Electronics Industry segment includes design, development, manufacture, marketing and servicing of solutions designed to enable the production of electronic products. The Company's products in this segment include AOI, repair, imaging, laser drilling, and pre-production products for use in the manufacture of PCBs, AOI, test, repair and yield -enhancement and process-enabling systems used in the manufacture of FPDs and etch, PVD and CVD equipment for use in the manufacture of MEMS, Advanced Packaging, power and RF devices and HBLED devices.

Solar Energy

The Company's Solar Energy segment includes the design, development, manufacture of solar photovoltaic energy systems. It also includes marketing of solar photovoltaic energy systems that produce electricity directly from sunlight.

Recognition Software

The Company's Recognition Software segment includes the development and marketing of check processing and healthcare payment automation solutions. It also includes related forms processing to banks, financial and other payment processing institutions by Orbograph.

The Company competes with Camtek, Dainippon Screen, GigaVis, Inspec, Machvision, ORC Imaging, Ushio/Adtec, Via Mechanics, Hans Laser, Via Mechanics, Mitsubishi, Electro Scientific Industries, Inc., EO Technics Co. Ltd., MicroCraft, HB Technology Co. Ltd., LG PRI, ADP Engineering Co. Ltd., Favite Inc., 3i Systems Co. Ltd., Applied Materials, Inc., Digital Imaging Technology Co. Ltd., Top Engineering Co. Ltd., Charm Engineering Co. Ltd., V-technology, Contrel Technology Co. Ltd., Cowin DST Co. Ltd., Lam Research, AMEC, Evatec, MEMSTAR, Advanced Modular Systems and PlasmaTherm.

Company Address

Orbotech Ltd

7 SANHEDRIN BOULEVARD
NORTH INDUSTRIAL ZONE P. O. BOX
YAVNE     8110101
P: +9728.9423533
F: +9728.9438769

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