Profile: Rudolph Technologies Inc (RTEC.OQ)
12.63USD
1 Aug 2013
$0.28 (+2.27%)
$12.35
$12.46
$12.71
$12.45
48,775
69,310
$14.09
$9.14
Rudolph Technologies, Inc., incorporated on June 13, 1996, is engaged in the design, development, and manufacture of process control defect inspection, metrology, and process control software systems used by microelectronics device manufacturers. The Company provides yield management solutions used in both wafer processing and final manufacturing through a family of standalone systems for macro-defect inspection, probe card test and analysis, and transparent and opaque thin film measurements. It markets and sells products to logic, memory, data storage and application-specific integrated circuit (ASIC) device manufacturers. In Inspection Systems, the Company’s chip manufacturers deploy macro-defect inspection throughout the fab to monitor key process steps. The Company’s transparent film technology uses up to four lasers operating simultaneously at multiple angles and multiple wavelengths, providing analysis and measurement capabilities. In June 2012, the Company acquired the assets of NanoPhotonics GmbH, Mainz, Germany. In April 2013, Rudolph Technologies Inc acquired the assets of Tamar Technology.
The Company’s Field-established tools, such as the F30 and NSX inspection systems are found in wafer processing (front-end) and final manufacturing (back-end) facilities worldwide. These tools incorporate features, such as waferless recipe creation, tool-to-tool correlation and multiple inspection resolutions. In addition to wafer frontside inspection, Rudolph's Explorer Inspection Cluster incorporates wafer edge and backside inspection in one integrated platform to enhance productivity and continuously improve fab yield. Using products, such as Discover and Genesis software, the amount of data gathered through automated inspection can be analyzed and classified to determine trends that ultimately affect yield.
Rudolph's S3000 System employs a reflectometer technology that allows the characterization of films and film stacks that cannot be performed using conventional reflectometry or ellipsometry alone. For opaque film characterization, the MetaPULSE System gives customers the ability to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non-contact manner on product wafers. PULSE Technology uses an ultra-fast laser to generate sound waves that pass down through a stack of opaque films, such as those used in copper or aluminum interconnect processes, sending back to the surface an echo that indicates film thickness, density, and other process critical parameters.
The Company has an offering of process control software solutions for semiconductor, solar and light-emitting diode (LED) manufacturing. It provides a range of advanced process control solutions, all designed to improve factory profitability, including run-to-run control, fault detection, classification and tool automation. Rudolph is a #1 provider of Process Control Software in the semiconductor industry.
The Company’s defect detection and classification technologies allow the Company to provide yield enhancement for critical front-end processes, such as photolithography, diffusion, etch, chemical mechanical polishing (CMP) and outgoing quality control. All-surface refers to inspection of the wafer frontside, edge and backside, as well as post-fab die. The edge inspection process focuses on the area near the wafer edge, an area that poses difficulty for traditional wafer frontside inspection technology due to its varied topography and process variation. In addition to the wafer processing floor, its automated inspection systems are used in several post-fab processes, such as bump inspection, wafer probe, wafer saw and quality control and in new process technologies, such as through-silicon-via (TSV).
The Company’s classifying defects off-line enables automated inspection systems to maintain their high throughput. Using defect image files captured by automated inspection systems, operators are able to view high-resolution defect images to determine defects that cause catastrophic failure of a device, or killer defects. Defect data analysis is performed to identify, analyze and locate the source of defects and other manufacturing process excursions. Using either a single wafer map or a composite map created from multiple wafer maps, this analysis enables identification of defect patterns and distribution. The combination of three-dimensional (3D)-optical comparative metrology (OCM) technology is designed to reduce total test time for even the advanced area probe cards. 3-D capabilities enable users to analyze probe marks and probe tips in a rapid and information-rich format.
The Company’s optical acoustic metrology involves the use of ultra-fast laser induced sonar for metal and opaque thin film measurement. The echo’s amplitude and phase can be used to detect film properties, missing layers and interlayer problems. The optical acoustic technology in its PULSE Technology systems measures the thickness of single or multi-layer opaque films ranging from less than 40 Angstroms to greater than five microns. It provides these measurements at a rate of up to 70 wafers per hour within 1 to 2% accuracy and typically less than 1% repeatability. Its ellipsometry is a non-contact, non-destructive optical technique for transparent thin film measurement. For applications requiring spectral coverage, some of its ellipsometry tools are also equipped with a reflectometer. Reflectometry uses a white or ultraviolet light source to determine the properties of transparent thin films by analyzing the wavelength and intensity of light reflected from the surface of a wafer. Its dvanced Process Control (APC) employs software to automatically detect or predict tool failure (fault detection) as well as calculate recipe settings for a process that will drive the process output to target despite variations in the incoming material and disturbances within the process equipment.
The Company’s inspection and test systems products include AXi Inspection Module, F30 Inspection Module, E30 Inspection Module, B30 Inspection Module, Explorer Inspection Cluster, NSX Inspection System, Wafer Scanner Inspection System, PrecisionWoRx System, ProbeWoRx System and WaferWoRx System. Its metrology systems products include MetaPULSE System and S3000 System. Its data analysis and review software products include ARTIST Software, AutoShell Software, ControlWORKS Software, Discover Software, Discover Enterprise Software, Discover Solar Software, GateWay Software, HarmonyASR Software, Process Sentinel Software, ProcessWORKS Software, RecipeWORKS Software, TrackWORKS Software, TrueADC Software, TrueADC Enterprise Software, Yield Optimizer Software and Genesis Software.
The Company competes with KLA-Tencor, Camtek, Ultratech, Nanometrics and Nikon.
Company Address
Rudolph Technologies Inc
One Rudolph Road,
P.O. Box 1000
FLANDERS NJ 07836
P: +1973.6911300
F: +1973.6914863
Company Web Links
| Name | Compensation |
|---|---|
Paul McLaughlin |
1,840,010 |
Richard Spanier |
-- |
Steven Roth |
522,851 |
Nathan Little |
570,057 |
D. Mayson Brooks |
388,974 |

