Siliconware Precision Industries Co Ltd (SPIL.O) Company Profile | Reuters.com
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Profile: Siliconware Precision Industries Co Ltd (SPIL.O)

SPIL.O on Nasdaq

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24 Jun 2016
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Siliconware Precision Industries Co., Ltd., incorporated on May 17, 1984, provides semiconductor packaging and testing services. The Company offers a range of packaging and testing solutions, including packages, substrate packages and lead-frame packages, as well as testing for logic and mixed signal devices. The Company also offers its customers turnkey service, from packaging and testing to shipment service. It provides packaging and testing services to approximately 100 customers across the world. The Company focuses on customers in the personal computer, communications, consumer integrated circuits and non-commodity memory semiconductor markets. The Company provides services in Taiwan through its facilities located in Taichung, Hsinchu and Changhua.

The manufacturing services that the Company offers are customized to the needs of its individual customers. The Company offers a range of package formats designed to provide its customers with an array of packaging solutions. The packaging solutions the Company offers to its customers include substrate packages, which include ball grid array and system in packages (incorporating multiple semiconductor chips) and flip-chip ball grid array packages, together with lead-frame packages. Its lead-frame packaging has electrical connections from the semiconductor device to the electronic product through leads on the perimeter of the package. Its substrate packaging has balls on the bottom of the package that create the electrical connections with the electronic system and can support various electrical connections. The Company develops packaging technologies, such as flip-chip and wafer bumping technologies. The Company offers lead-frame packaging with a range of lead counts and body sizes to satisfy variations in the size of customers' semiconductor devices. The Company works with its customers to develop and convert programs to test particular semiconductor products on multiple equipment platforms. The Company also provides testing services, such as wafer probing, final testing and other testing services.

The Company provides final testing services for a range of logic and mixed signal and radio frequency (RF) integrated circuit packages and other integrated circuit packages, including complex and high-performance integrated circuits, as well as lower-performance ones. The Company provides change kit and socket design services for mixed signal and RF integrated circuits. The Company also provides system-level testing service for testing products on motherboards, lead/ball scanner service to screen out abnormal products, including bent lead or ball defective devices, marking service to specify the customer logo and batch identification on products and tape and reel service for packaging devices into a reel for surface mount operation.

The Company offers Ball Grid Array (BGA), Chip Scale Package (CSP), Memory Card, Multi-Package and Stacked Die. Its technologies include Thin Wafer Technology, Thin Molding Technology, Fingerprint Sensor Assembly Technology and Fine Pitch Wire Bonding Technology. It provides a range of services, including assembly services, test services and bumping services.

The Company competes with Advanced Semiconductor Engineering, Inc. (Taiwan), Amkor Technology Inc. (USA) and Jiangsu Changjiang Electronics Technology Co., Ltd (China).

Company Address

Siliconware Precision Industries Co Ltd

No. 123, Sec. 3
Section 3, Da Fong Road, Dafong
Tantzu
TAICHUNG     427
P: +88642.5341525
F: +8864.25346278

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