Profile: Siliconware Precision Industries Co Ltd (SPIL.O)

SPIL.O on Nasdaq

7.85USD
21 Jul 2014
Price Change (% chg)

$0.07 (+0.90%)
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Siliconware Precision Industries Co., Ltd., incorporated on May 17, 1984, is an independent provider of semiconductor packaging and testing services. The Company offers a range of packaging and testing solutions, including advanced substrate packages, such as the flip-chip ball grid array and lead-frame packages, as well as testing for logic, mixed signal and embedded memory devices. The Company also offer its customers service from packaging and testing to shipment service. The Company provides packaging and testing services to more than 100 customers worldwide. During the year ended December 31, 2009, the Company customers included Advanced Micro Devices Inc., Broadcom Corporation, Intel Corporation, MediaTek Inc., Marvell Semiconductor Inc., NVIDIA Corp., SanDisk Corporation and Xilinx, Inc. As of December 31, 2009, the Company held a 14.5% equity interest in ChipMOS Bermuda, a semiconductor packaging and testing and liquid crystal display (LCD) driver and integrated circuit (IC) manufacturing company.

The packaging solutions the Company offers to its customers include substrate packages, which include ball grid array and system in packages (incorporating multiple semiconductor chips) and flip-chip ball gird array packages, together with lead-frame packages. The Company’s flip-chip ball grid array packages are based on the Flex-On-Cap wafer bumping and redistribution technologies. Semiconductor packaging serves to protect semiconductor chips, to facilitate their integration into electronic systems and to enable the dissipation of heat produced by the final product. The Company’s substrate packaging has balls on the bottom of the package that create the electrical connections with the electronic system and can support larger numbers of electrical connections.

Substrate Packages

Substrate packages category employs the ball grid array design, which utilizes a laminated substrate rather than a lead-frame and places the electrical connections on the bottom of the package rather than around the perimeter. The ball grid array format was developed to address the need for higher lead counts required by advanced semiconductor devices. To address the electronics market demand for higher frequency, higher input/output and better thermal performance, the Company develops packaging technologies, such as flip-chip and wafer bumping technologies.

Flip-chip ball grid array is a high-end, high-growth packaging technology used in advanced semiconductor products, such as microprocessor units, micro peripherals, field programmable gate arrays and application specific ICs. The flip-chip technology enables direct interconnection from the chip to the substrate, eliminates the need for wire bonding and provides superior electrical performance. The Company has developed module packages, with multiple chips integrated into one package.

Lead-Frame Packages

Lead-frame packages are characterized by a semiconductor chip encapsulated in a plastic molding compound with metal leads on the perimeter. This package category has evolved from a design where the leads are plugged into holes on the circuit board to a design where the leads are soldered to the surface of the circuit board. Lead-frame packages are divided into two types of packages: quad flat packages and small outline packages.

Testing and Other Services

The Company provides a variety of testing services, which include wafer probing, final testing and other testing services. Wafer probing is the step immediately before packaging of ICs and involves sorting the processed wafer for defects to ensure that it meets customer acceptance criteria. ICs on an accepted wafer are then individually inspected visually under microscopes before packaging and final testing.

The Company provides final testing services for a variety of logic and mixed signal and radio frequency integrated circuits (RFICs) packages, double data rate (DDR) II memory, memory card and other IC packages, including high-performance ICs, as well as lower-performance ones. High-performance products include personal computer-related components, such as central processing unit (CPU) chipsets and graphic processors, while major lower-performance products include ICs used in consumer electronics products.

The Company provides system-level testing service for testing products on motherboards, test during burn-in (TDBI)-test during burn-in service to screen out device infant mortality, laser repair/laser trim service to modify device connection structure for specific product applications and lead/ball scanner service to screen out abnormal products, including bent lead or ball defective devices, so as to prevent them from being shipped to the end customers. It also provides marking service to specify the customer logo and batch identification on products, and tape and reel service to packaging devices into one complete reel for surface mount operation.

The Company competes with Advanced Semiconductor Engineering, Inc., Amkor Technology Inc. and STATS ChipPAC Ltd.

Company Address

Siliconware Precision Industries Co Ltd

No. 123, Sec. 3
Section 3, Da Fong Road, Dafong
Tantzu
TAICHUNG     427
P: +88642.5341525
F: +88642.5346278

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