Profile: Teradyne Inc (TER)
2 Dec 2016
Teradyne, Inc. (Teradyne), incorporated on September 23, 1960, is a supplier of automation equipment for test and industrial applications. The Company designs, develops, manufactures and sells automatic test systems used to test semiconductors, wireless products, data storage and complex electronics systems in the consumer electronics, wireless, automotive, industrial, computing, communications and aerospace and defense industries. The Company operates through four segments: Semiconductor Test, System Test, Wireless Test and Industrial Automation.
The Semiconductor Test segment includes operations related to the design, manufacturing and marketing of semiconductor test products and services. The System Test segment includes operations related to the design, manufacturing and marketing of products and services for defense/aerospace instrumentation test, storage test and circuit-board test. The Wireless Test segment includes operations related to the design, manufacturing and marketing of wireless test products and services. The Industrial Automation segment includes operations related to the design, manufacturing and marketing of collaborative robots. Its industrial automation products include collaborative robots used by global manufacturing and light industrial customers. Its automatic test equipment and industrial automation products and services include semiconductor test (Semiconductor Test) systems; defense/aerospace (Defense/Aerospace) test instrumentation and systems, storage test (Storage Test) systems, and circuit-board test and inspection (Production Board Test) systems (collectively these products represent System Test); wireless test (Wireless Test) systems, and industrial automation (Industrial Automation) products.
The Company has a customer base, which includes integrated device manufacturers (IDMs), outsourced semiconductor assembly and test providers (OSATs), wafer foundries, fabless companies that design, but contract with others for the manufacture of integrated circuits (ICs), developers of wireless devices and consumer electronics, manufacturers of circuit boards, automotive suppliers, wireless product manufacturers, storage device manufacturers, aerospace and military contractors, and distributors that sell collaborative robots.
The Company designs, manufactures, sells and supports Semiconductor Test products and services around the world. The test systems, which the Company provides are used for both wafer level and device package testing. These chips are used in automotive, industrial, communications, consumer, and computer and electronic game applications, among others. The Semiconductor Test products and services are sold to IDMs that integrate the fabrication of silicon wafers into their business, Fabless companies that outsource the manufacturing of silicon wafers, Foundries that cater to the processing and manufacturing of silicon wafers, and OSATs that provide test and assembly services for the final packaged devices to both Fabless companies and IDMs.
The FLEX Test Platform has an installed base of approximately 4,700 systems. The Company's J750 test system shares the IG-XL software environment with the family of FLEX Test Platform systems. The J750 is designed to address semiconductor devices, such as microcontrollers that are central to the functionality of consumer electronics product, from small appliances to automotive engine controllers. The Company extended the J750 platform technology to create the IP750 Image Sensor test system. The IP750 is focused on testing image sensor devices used in smart phones and other imaging products. The J750 platform has an installed base of over 4,800 systems.
The Company's Magnum platform addresses the requirements of mass production test of memory devices, such as flash memory and dynamic random access memory (DRAM). The Flash and DRAM memory devices have application in consumer, industrial and computing equipment. The Magnum V is a memory test solution designed for parallel memory test in the flash, DRAM and multi-chip package markets. The Magnum platform has an installed base of over 1,800 systems.
The Company's ETS platform is used by semiconductor manufacturers and assembly and test subcontractors, primarily in the low pin count analog or mixed signal discrete markets. Semiconductors tested by these systems are incorporated into a range of products, including mobile devices, video/multimedia products, automotive electronics, computer peripherals and notebook and desktop computers. The Company's ETS-88, a multi-site production test system is designed to test a range of volume commodity and precision devices. The ETS platform has an installed base of over 3,700 systems.
The Company competes with Advantest Corporation and Xcerra Corporation.
The Company's Systems Test segment consists of three business units: Defense/Aerospace, Storage Test and Production Board Test. The Company is a provider of test systems, subsystems, instruments and service for the defense and aerospace markets. Its test products are used to ensure the readiness of military and commercial aerospace electronics systems. Its test products are well suited to the demands of defense/aerospace electronics manufacturers and repair depots around the world. The Storage Test business unit addresses the automated manufacturing test requirements of hard disk drive (HDD) and solid state disk (SSD) manufacturers. It offers products for the client and enterprise storage markets. Its test systems are used by electronics manufacturers around the world to perform In-Circuit-Test (ICT) and device programming of printed circuit board assemblies. The Company offers the Test Station in off-line and automated in-line configurations. The automated in-line configurations address the growing requirements for automating production lines for applications, such as automotive electronics.
The Company competes with Keysight Technologies, Inc., Astronics, Test Research Inc. and SPEA S.p.A.
The Company's LitePoint designs, develops and supports advanced wireless test equipment for the manufacturing of wireless devices, including smart phones, tablets, notebooks, laptops, personal computer (PC) peripherals, and other wireless fidelity (Wi-Fi), Bluetooth, Near Field Communication (NFC) and cellular enabled devices. LitePoint collaborates with developers, chipset/component manufacturers and manufacturing leaders to create agile systems. LitePoint's IQ product line falls into over two test categories: cellular and connectivity. The IQxstream is a multi-device under test (DUT) optimized solution for high-speed testing of global system for mobile (GSM), code division multiple access 2000 (CDMA2000), time division synchronous code division multiple access (TD-SCDMA), wideband code division multiple access (WCDMA), high speed packet access+ (HSPA+), long-term evolution-frequency-division duplexing (LTE-FDD), time division (TD)-LTE and LTE-Advanced technologies used for calibration and verification of smartphones, tablets, small cell wireless gateways and embedded cellular modules.
IQxstream is complemented by IQvector, a production-optimized testing package that supports the cellular chipset solutions and allows manufacturers to ramp volume production in a matter of weeks, rather than months. The Company offers a range of test equipment for multi-DUT connectivity testing. The IQxel family enables calibration and verification of the Wi-Fi standard 802.11ac. The IQxel family supports multiple bandwidth and channel configurations, multiple input multiple output (MIMO) antenna arrangements, Bluetooth Classic and Low Energy, and covers the range of communication standards. These solutions target manufacturers of networking equipment, Internet access devices, Internet of Things (IoT) products and embedded modules used in smartphones, tablets and PCs.
The Company offers IQfact+, a chipset-optimized, customizable software library covering over 300 wireless IC solutions. It offers the zSeries of modular wireless test instruments for the design verification test of wireless components and chipsets. The lab-in-a-box zSeries solution provides design verification of radio frequency (RF) power amplifier and smart device RF front end modules. It is capable of rapid analysis of the digital pre-distortion and envelope tracking technologies for both long term evolution (LTE) and WiFi standards.
The Company competes with Rohde & Schwarz GmbH & Co. KG, Anritsu Company, Keysight Technologies, Inc., Cobham/Aeroflex, Inc. and National Instruments Corporation.
The Company's Universal Robots supply collaborative robots that work side by side with production workers. Collaborative robots are designed to mimic the motion of a human arm and can be fitted with task specific grippers or fixtures to support a range of applications. Universal Robots offer over three collaborative robot models, the UR3, UR5 and UR10, each with different weight carrying capacity and arm reach.
The Company competes with KUKA Robotics Corporation, ABB, FANUC and Yaskawa Electric Corporation.
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