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Profile: Taiwan Semiconductor Manufacturing Co Ltd (TSM.N)

TSM.N on New York Stock Exchange

30 Sep 2016
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Taiwan Semiconductor Manufacturing Company Limited, incorporated on February 21, 1987, is a foundry, which manufactures semiconductors using its manufacturing processes for its customers based on their own or third parties' integrated circuit designs. The Company offers a range of wafer fabrication processes, including processes to manufacture complementary metal oxide silicon (CMOS) logic, mixed-signal, radio frequency, embedded memory, bipolar complementary metal oxide silicon (BiCMOS) mixed-signal and other semiconductors. It operates through the foundry segment, which engages mainly in the manufacturing, selling, packaging, testing and computer-aided design of integrated circuits and other semiconductor devices and the manufacturing of masks. The Company also has other operating segments, which engage in the researching, developing, designing, manufacturing and selling of solid state lighting devices and renewable energy and efficiency related technologies and products. The Company also offers design, bumping, probing, and assembly and testing services.

As of December 31, 2015, the Company's corporate headquarters and five of its fabs were located in the Hsinchu Science Park, two fabs were located in the Southern Taiwan Science Park, one fab was located in the Central Taiwan Science Park, one fab was located in the United States, and one fab was located in Shanghai. Its corporate headquarters and its approximately five fabs in Hsinchu occupy parcels of land of over 613,804 square meters. The Company leases these parcels from the Hsinchu Science Park Administration in Hsinchu. The Company has leased from the Central Taiwan Science Park Administration a parcel of land of 564,619 square meters for its Taichung fabs, as of December 31, 2015. The Company had leased from the Southern Taiwan Science Park Administration, 765,420 square meters of land for its fabs in the Southern Taiwan Science Park, as of December 31, 2015. As of December 31, 2015, the Company also owned 143,215 square meters of land located in Miaoli, Taiwan. Other than certain equipment under leases located at testing areas, the Company owns all of the buildings and equipment for its fabs.

The Company manufactures semiconductors using the CMOS and BiCMOS, which uses CMOS transistors in conjunction with bipolar junction transistor processes. The Company manufactures various types of semiconductors with different specific functions by changing the number and the combinations of conducting, insulating and semiconducting layers and by defining different patterns in which such layers are applied on the wafer. The Company makes mixed-signal/radio frequency (RF) semiconductors using both the CMOS and BiCMOS processes. The Company offers CMOS mixed-signal process down to the 28-nanometer technology for manufacturing mixed-signal/RF semiconductors. The primary uses of mixed-signal/RF semiconductors are in hard disk drives, wireless communications equipment and network communications equipment, with those made with the BiCMOS process occupying the higher end of the mixed-signal/RF market. The Company offers a range of high-voltage processes, including high voltage CMOS (HVCMOS), bipolar-CMOS-diffusion metal oxide semiconductor (DMOS) (BCD) and ultra-high voltage technology (UHV), ranging from 5 volts to 800 volts, which are suitable for various panel-size display driver and power supply applications.

Company Address

Taiwan Semiconductor Manufacturing Co Ltd

Li-Hsin Road 6, Hsinchu Science
HSINCHU     300
P: +8863.5636688
F: +8863.5790893

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