Profile: TTM Technologies Inc (TTMI.OQ)
9.23USD
1 Aug 2013
$-0.01 (-0.11%)
$9.24
$9.35
$9.35
$9.15
70,491
85,769
$10.97
$6.53
TTM Technologies, Inc. (TTM), incorporated on June 21, 2005, is a provider of time-critical and technologically complex printed circuit board (PCB) products and backplane assemblies (PCBs populated with electronic components), which serves as the foundation of sophisticated electronic products. It focuses on providing time-to-market and advanced technology products and offer a one-stop manufacturing solution to its customers from engineering support to prototype development through final volume production. This one-stop solution allows them to align technology development with the diversified needs of its customers, many of whom are based in high growth markets, and to enable them to reduce the time required to develop new products and bring them to market. It serves a diversified customer base consisting of approximately 1,025 customers in various markets throughout the world, including manufacturers of networking/communications infrastructure products, touch screen tablets and mobile media devices (e-readers and smartphones). It also serves the high-end computing, aerospace/defense, and industrial/medical industries. Its customers include both original equipment manufacturers (OEMs) and electronic manufacturing services (EMS) providers.
As of December 31, 2012, the Company operated a total of 15 specialized and integrated facilities in the United States and China. It manage its
worldwide operations based on two geographic operating segments: (1) Asia Pacific, which consists of the PCB Subsidiaries and their seven PCB fabrication plants, which include a substrate facility; and (2) North America, which consists of seven domestic PCB fabrication plants, including a facility that provides follow-on value-added services primarily for one of the PCB fabrication plants, and one backplane assembly plant in Shanghai, China, which is managed in conjunction with its U.S. operations. Each segment operates predominantly in the same industry with production facilities that produce similar customized products for its customers and use similar means of product distribution.
The Company offers a wide range of PCB products, including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. It also offer certain value-added services to support its customers’ needs. These include design for manufacturability (DFM) support during new product introduction stages; PCB layout design; simulation and testing services; QTA production; and drilling and routing services. By providing these value-added services to customers, it is able provide its customers with a one-stop manufacturing solution, which enhances its
relationships with its customers.
Conventional PCBs
A PCB is a board containing a pattern of conducting material, such as copper, which becomes an electrical circuit when electrical components are attached to it. It is the basic platform used to interconnect electronic components and can be found in electronic products, including computers and computer peripherals, communications equipment, cellular phones, high-end consumer electronics, automotive components and medical and industrial equipment. PCBs are more product-specific than other electronic components because generally they are for a specific electronic device or appliance. Conventional PCBs can be classified as single-sided, double-sided and multi-layer boards.
A multi-layer PCB can accommodate more complex circuitry than a double-sided PCB. It has more than two copper circuit layers with pieces of laminate bonded by resin between layers. Multi-layer PCBs require more sophisticated production techniques compared to single and double-sided PCBs, as, among other things, they require high precision manufacturing and more stringent product . The number of layers comprising a PCB generally increases with the complexity of the end product. For example, a simple consumer device such as a garage door controller may use a single-sided or double-sided PCB, while a high-end network router or computer server may use a PCB with 20 layers or more.
High density interconnect or HDI PCBs
Its North America and Asia Pacific operating segments produce HDI PCBs, which are PCBs with higher interconnect density per unit area requiring more sophisticated technology and manufacturing processes for their production than conventional PCB products. HDI PCBs are boards with high-density characteristics including micro-sized holes, or microvias (diameter at or less than 0.15 mm), lines (circuit line width and spacing at or less than 0.075 mm) and can be constructed with thin high performance materials, thereby enabling more interconnection functions per unit area. HDI PCBs generally are manufactured using a sequential build-up process in which circuitry is formed in the PCB one layer at a time through successive drilling, plating and lamination cycles. In general, a board’s complexity is a function of interconnect and circuit density, layer count, laminate material type and surface finishes. As electronic devices have become smaller and more portable with higher functionality, demand for advanced HDI PCB products has increased. It defines advanced HDI PCBs as those having more than one layer of microvia interconnection structure.
Flexible PCBs
Flexible PCBs are printed circuits produced on a flexible laminate, allowing it to be folded or bent to fit the available space or allow relative movement. It manufacture circuits on flexible substrates that can be installed in three-dimensional applications for electronic packaging systems. Use of flexible circuitry can enable improved reliability, improved electrical performance, reduced weight and reduced assembly costs when compared with traditional wire harness or ribbon cable packaging. Flexible PCBs can provide flexible electronic connectivity of an electrical device’s apparatus such as printer heads, cameras, camcorders, TVs, mobile handsets, and touch screen tablets. For some of its flexible PCB customers it also assembles components onto the flexible PCBs it manufacture.
Rigid-flex PCBs
Rigid-flex circuitry provides a simple means to integrate multiple PCB assemblies and other elements such as display, input or storage devices without wires, cables or connectors, replacing them with thin, light composites that integrate wiring in ultra-thin, flexible ribbons between sections. In rigid-flex packaging, a flexible circuit substrate provides a backbone of wiring with rigid multilayer circuit sections built up as modules where needed.
Since the ribbons can be bent or folded, rigid-flex provides a means to compactly package electronics in three dimensions with dynamic or static bending functions as required, enabling miniaturization and thinness of product design. The simplicity of rigid-flex integration also generally reduces the number of parts required, which can improve reliability. The increasing popularity of mobile electronics coupled with the design trend of developing increasingly thinner, lighter and more feature-rich products is expected to further drive growth in the rigid-flex and flex sector, where these PCBs are the backbone of miniaturization.
Rigid-flex technology is essential to a broad range of applications including aerospace, industrial and transportation systems requiring high reliability; hand-held and wearable electronics such as mobile phones, video cameras and music players where thinness and mechanical articulation are essential; and ultra-miniaturized products such as headsets, medical implants and semiconductor packaging where size and reliability are paramount.
Backplane assemblies
A backplane is an interconnecting device that has circuitry and sockets into which PCBs or other additional electronic devices can be plugged. In a computer, these may be referred to as a motherboard. The manufacture of backplane assemblies involves mounting various electronic components to PCBs. Components include, but are not limited to, connectors, capacitors, resistors, diodes, integrated circuits, hardware and a variety of other parts. Itcan assemble backplanes and sub-systems and provide full system integration of backplane assemblies, cabling, power, thermal, and other complex electromechanical parts into chassis and other enclosures. In addition to assembly services, it provides inspection and testing services such as automated optical inspection (AOI) and X-ray inspection to ensure that all components have been properly placed and electrical circuits are complete. It focus is to provide backplane and sub-system assembly products primarily as an extension of its commercial and aerospace/defense PCB offerings.
IC substrates
substrates are mounts that are used to connect small ICs (integrated circuits or semiconductors) to comparatively larger PCBs for assembly into electronic end products such as memory modules, cellular phones, digital cameras, automotive GPS and engine controls. IC substrates, also known as IC carriers, are miniaturized circuits manufactured by a process largely similar to that for PCBs but requiring the use of ultra-thin materials and including micron-scale features, as they must bridge the gap between sub-micron IC features and millimeter scale PCBs. Consequently, IC substrates are generally manufactured in a semiconductor-grade clean room environment to ensure products are free of defects and contamination.
IC substrates are a basic component of IC packages which, combined with other electronic components in an assembly, control functions of an electronic appliance. IC packages can be broadly divided into single chip modules (or SCMs) and multi-chip modules (or MCMs), with the former containing one IC chip, and the latter containing multiple chips and other electronic components.
Quick turnaround services
The Company refer to its rapid delivery services as quick turnaround or QTA, because it provides custom-fabricated PCBs to its customers within as little as 24 hours to 10 days. As a result of its ability to rapidly and reliably respond to the critical time requirements of its customers, it generally receive pricing for its QTA services as compared to standard lead time prices. In the design, testing, and launch phase of a new electronic product’s life cycle, its customers typically require limited quantities of PCBs in a short period of time. It satisfies this need by manufacturing prototype PCBs in small quantities, with delivery times ranging from as little as 24 hours to 10 days. After a product has successfully completed the prototype phase, its customers introduce the product to the market and require larger quantities of PCBs in a short period of time. This transition stage between low-volume prototype production and volume production is known as ramp-to-volume. Its ramp-to-volume services typically include manufacturing up to a few hundred PCBs per order with delivery times ranging from 5 to 15 days.
The Company competes with Unimicron, Ibiden, Tripod, Foxconn, Viasystems, Sanmina, Multek , Wus, Amphenol, Sanmina, Simclar, TT Electronics, and Viasystems.
Company Address
TTM Technologies Inc
Suite 250, 1665 Scenic Avenue
COSTA MESA CA 92626
P: +1714.3273000
F: +1302.6555049
Company Web Links
| Name | Compensation |
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Robert Klatell |
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Thomas Edman |
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Kenton Alder |
1,902,850 |
Todd Schull |
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Tai Keung Chung |
1,414,480 |

