Profile: United Microelectronics Corp (UMC.N)
2 Dec 2016
United Microelectronics Corporation, incorporated on May 22, 1980, is a global semiconductor foundry that provides technology and manufacturing for applications spanning various sectors of the integrated circuit (IC) industry. The Company operates through two segments: wafer fabrication and new business. The primary operating activity of the Company's wafer fabrication segment is the manufacture of chips to the design specifications of its customers by using its own processes and techniques. The new business segment primarily includes researching, developing, manufacturing, and providing solar energy and new generation light-emitting diode (LED). The Company maintains a customer base across various industries, including communication, consumer electronics, computer, memory and others.
The Company has over two approximately 300 millimeter fabs in operation. The Company's over 28 nanometer (nm) process technologies include its over 28nm high performance low power (28HLP) Poly- silicon oxynitride (SiON) and 28nm High-k/metal gate stack (28HPM/HPC) processes. The Company's 28HLP process provides a natural migration from over 40 nanometers. The Company's 28HPM process supports various device options, targeting a range of products, such as application processor, cellular baseband, wireless local area network (WLAN), tablet, field-programmable gate array (FPGA) and networking ICs. The Company offers Auto, which is a platform that consists of a portfolio of automotive AEC-Q100 technology solutions.
The Company provides solutions, testing services, package solution development and product yield management services. The Company's testing and packaging services include design service, mask tooling, wafer process, wafer bumping, back lapping, wafer sorting, backend services, yield management, packaging, final test and drop ship services. The Company's testing services include test solution development, which includes customer-aligned tester solution, program development, and validation and test hardware design; testing optimization, which includes test efficiency improvement and test yield robustness; volume production, which includes real-time data feedback, and yield monitor and wafer sort statistical bin control (SBC), and yield management, which includes yield analysis and diagnosis for continuous yield enhancement. The Company also works with various packaging houses to provide silicon proven packaging solutions. The Company's test and package subcontractors are located in Taiwan and across Asia. The Company's product yield management service consists of over three stages, namely, design and tape-out, pilot run success and production yield ramp.
The Company also provides design support services, such as mask service, silicon shuttle, libraries and Internet protocol (IP), design verification, design for manufacturing (DFM), design kit, and manual and Design Flow Reference. The Company's Foundry Design Kit (FDK) provides IC designers with an automatic design environment. The Company's Virtual Inductor Library (VIL) is a parameterized spiral inductor design kit based on full-wave simulation. The Optimum Inductor Finder (OIF) gives designers the ability to access a library of inductor optimization. The Company also offers Optimized Capacitor Finder (OCF) and Optimized Transformer Finder (OTF) in FDK package. The Company also provides a design support manual.
The Company competes with Taiwan Semiconductor Manufacturing Company Limited, Semiconductor Manufacturing International (Shanghai) Corporation, Globalfoundries Inc., IBM, Intel, Samsung Electronics, Toshiba Corporation, DongbuAnam Semiconductor, Grace Semiconductor Manufacturing Corp., X-FAB Semiconductors Foundries AG and Silterra Malaysia Sdn. Bhd.
United Microelectronics Corp
Li-Shin Road II, Hsinchu Science