United States

Profile: Veeco Instruments Inc (VECO.O)

VECO.O on Nasdaq

17 Feb 2017
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$0.60 (+2.23%)
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Veeco Instruments Inc., incorporated on August 8, 1989, designs, manufactures, markets and supports thin film equipment. The Company's equipment is used to make electronic devices, including light emitting diodes (LED), micro-electromechanical systems (MEMS), wireless devices, power electronics, hard disk drives (HDDs) and semiconductors. The Company operates in four geographic regions: United States; China; Europe, the Middle East and Africa, and the Rest of World.

Metal Organic Chemical Vapor Deposition Systems

The Company is a supplier of metal organic chemical vapor deposition (MOCVD) systems. MOCVD production systems are used to make gallium nitride (GaN)-based devices, such as blue and green LEDs, and Arsenic Phosphide (AsP)-based devices, such as red, orange and yellow LEDs, which are used in television and computer backlighting, general illumination, large area signage, specialty illumination, power electronics, and many other applications. TurboDisc K475 AsP MOCVD systems are also used to make ROY LEDs and triple junction photovoltaic solar cells. Its Propel PowerGaN MOCVD System (Propel) enables the development of GaN-based power electronic devices. The Propel system offers 200 millimeter technology and incorporates single-wafer reactor technology.

Precision Surface Processing Systems

The Precision Surface Processing's platforms include WaferEtch and the WaferStorm. The product of the WaferEtch platform, the TSV Revealer, is configured to address the requirements of TSV reveal, which is the process where the backside of a wafer is thinned to reveal the copper interconnects. The WaferStorm platform is based on Precision Surface Processing's soak and spray technology.

Ion Beam Etch and Deposition Systems

The Company's NEXUS Ion Beam Deposition (IBD) systems utilize ion beam technology to deposit precise layers of thin films. IBD systems deposit thin film layers and provide maximum uniformity and repeatability. NEXUS Ion Beam Etch (IBE) systems utilize a charged particle beam consisting of ions to etch precise, complex features. The NEXUS systems may be included on its cluster system platform to allow either parallel or sequential deposition/etch processes. These systems are used by data storage and telecommunications device manufacturers in the fabrication of discrete and integrated microelectronic devices. The Company also provides an array of ion beam sources. These technologies are applicable in the hard drive industry, as well as for optical coatings and other end markets. Its SPECTOR systems offer manufacturers improvements in target material utilization, optical endpoint control, and process time for cutting-edge optical interference coating applications.

Molecular Beam Epitaxy Systems

The Molecular Beam Epitaxy (MBE) is the process of depositing epitaxially aligned atomically thin crystal layers, or epilayers, of elemental materials onto a substrate in an ultra-high vacuum environment. The Company's MBE systems, sources and components are used to develop and manufacture critical epitaxial layers in applications, such as solar cells, fiber lasers, infrared detectors, mobile phones, radar systems and displays. The Company provides MBE systems and components for the production of wireless devices, including power amplifiers, high electron mobility transistors or hetero-junction bipolar transistors, and an array of research applications for new compound semiconductor materials.

Other Deposition and Industrial Products

The Company makes an array of deposition systems, including Physical Vapor Deposition, Diamond Like Carbon Deposition and Chemical Vapor Deposition Systems. In addition, its Optium products are used in back-end applications in data storage fabrication facilities where thin film magnetic heads (TFMHs) or sliders are fabricated. This equipment includes lapping tools, which enable precise material removal within three nanometers, which is necessary for TFMHs. It also manufactures tools that slice and dice wafers into row bars and TFMHs.

The Company competes with Aixtron, AMEC, Applied Materials, Canon Anelva, DCA Instruments, Grand Plastics Technology Corporation, LAM Research, Leybold Optics, Oerlikon, Orbotech, Oxford Instruments, Riber, Scientech, Taiyo Nippon Sanso and Tang Optoelectronics Equipment Company.

Company Address

Veeco Instruments Inc

PLAINVIEW   NY   11803
P: +1516.6770200
F: +1516.7141200

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